Principal Semiconductor Packaging Engineer

JR United Kingdom; Milton Keynes; On-site; GBP 50,000 - 75,000; Full time

Job summary

A leading-edge client is seeking an experienced Principal Packaging Engineer to develop and produce quantum processor devices. The role includes creating innovative packaging methods, ensuring optimal performance through strong collaboration with suppliers and teams. The ideal candidate will have extensive experience in semiconductor and photonic technologies.

Qualifications

• Experience with package substrate technologies.
• Knowledge of die bonding methods for thermal/mechanical performance.
• Experience with 3rd party suppliers.

Responsibilities

• Steer the packaging roadmap for quantum processor devices.
• Develop wirebond and bumping methods.
• Design and supervise failure analysis experiments.

Skills

Semiconductor packaging methods

Photonic packaging methods

Communication skills

Job description

Social network you want to login/join with:

col-narrow-left

Client:

IC Resources

Location:

Job Category:

Other

-

EU work permit required:

Yes

col-narrow-right

Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

col-wide

Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.