Principal Semiconductor Packaging Engineer

JR United Kingdom; Dartford; On-site; GBP 35,000 - 55,000; Full time

Job summary

A leading-edge client in Oxford is seeking an experienced Packaging Engineer to lead the packaging roadmap for quantum processor devices. This role involves collaboration with internal and external providers, developing innovative packaging methods, and supervising critical experiments in a fast-paced environment.

Qualifications

• Experience with semiconductor/photonic packaging techniques and knowledge of package substrate technologies.
• Understanding of die bonding methods for thermal and mechanical efficiency.
• Experience collaborating with third-party suppliers.

Responsibilities

• Developing wirebond and bumping methods.
• Creating packaging solutions with optimal thermal performance.
• Designing and supervising failure analysis experiments.

Skills

Experience with semiconductor/photonic packaging techniques

Understanding of die bonding methods

Strong communication skills

Job description

Our leading-edge Oxford-based client is currently seeking an experienced Packaging Engineer to lead the packaging roadmap. The role involves collaborating with internal and external providers to develop and produce quantum processor devices.

Key responsibilities include:

• Developing wirebond and bumping methods
• Developing photonics packaging methods across various frequencies
• Creating packaging solutions with optimal thermal performance
• Designing and supervising failure analysis experiments

Required skills for the Packaging Engineer include:

• Experience with semiconductor/photonic packaging techniques and knowledge of package substrate technologies
• Understanding of die bonding methods for thermal and mechanical efficiency
• Experience collaborating with third-party suppliers
• Strong communication skills

For further details, please contact Rachel Anderson.