Principal Semiconductor Packaging Engineer

JR United Kingdom; Colchester; On-site; GBP 50,000 - 80,000; Full time

Job summary

An innovative technology firm based in Oxford is seeking a Principal Semiconductor Packaging Engineer in Colchester. The role focuses on developing packaging methods for quantum processors, requiring expertise in semiconductor/photonic packaging and strong communication skills. This position offers an exciting opportunity to work on advanced technologies and collaborate with both internal teams and external suppliers.

Qualifications

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies.
• Knowledge of die bonding methods for good thermal and mechanical performance.
• Experience working with 3rd party suppliers.

Responsibilities

• Steer the packaging roadmap and develop quantum processor devices.
• Design and supervise failure analysis experiments.

Skills

Semiconductor packaging methods

Photonics packaging methods

Die bonding methods

Communication skills

Job description

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Principal Semiconductor Packaging Engineer, colchester

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Client:

IC Resources

Location:

colchester, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

3

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.