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A leading company in quantum processor technology is seeking a Principal Packaging Engineer to lead the packaging roadmap. Responsibilities include developing innovative packaging methods, ensuring communication with suppliers, and conducting failure analyses. This is a crucial role in advancing cutting-edge technology within the semiconductor and photonics sectors.
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IC Resources
portsmouth, hampshire, United Kingdom
Other
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Yes
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2
04.06.2025
19.07.2025
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Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.
Required skills for the Principal Packaging Engineer will include:
Please contact Rachel Anderson for further details.