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Principal Semiconductor Packaging Engineer

JR United Kingdom

Portsmouth

On-site

GBP 50,000 - 70,000

Full time

2 days ago
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Job summary

A leading company in quantum processor technology is seeking a Principal Packaging Engineer to lead the packaging roadmap. Responsibilities include developing innovative packaging methods, ensuring communication with suppliers, and conducting failure analyses. This is a crucial role in advancing cutting-edge technology within the semiconductor and photonics sectors.

Qualifications

  • Proven experience in semiconductor/photonic packaging.
  • Knowledge of die bonding methods focused on thermal and mechanical performance.
  • Experience liaising with third-party suppliers.

Responsibilities

  • Steer the packaging roadmap for quantum processor devices.
  • Develop and produce photonics packaging methods across different frequencies.
  • Design and supervise failure analysis experiments.

Skills

Experience of semiconductor/photonic packaging methods
Knowledge of package substrate technologies
Knowledge of die bonding methods
Strong communication skills

Job description

Social network you want to login/join with:

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Client:

IC Resources

Location:

portsmouth, hampshire, United Kingdom

Job Category:

Other

-

EU work permit required:

Yes

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Job Views:

2

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

  • Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
  • Knowledge of die bonding methods for good thermal and mechanical performance
  • Experience working with 3rd party suppliers
  • Strong internal and external communication skills

Please contact Rachel Anderson for further details.

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