Principal Semiconductor Packaging Engineer

TN United Kingdom; London; Hybrid; GBP 60,000 - 100,000; Full time

Job summary

An exciting new technology start-up is seeking a Principal Semiconductor Packaging Engineer to lead the design of innovative IC packaging solutions for multi-die devices. This dynamic role offers the opportunity to shape the architecture of cutting-edge products while working in a flexible environment with remote and hybrid options. The ideal candidate will possess strong experience in semiconductor packaging, advanced knowledge of packaging technologies, and proficiency with Cadence EDA tools. Join a vibrant team where your expertise will drive the future of semiconductor technology and make a significant impact in the industry.

Qualifications

• Strong experience in IC semiconductor packaging and advanced packaging knowledge.
• Degree qualification in a relevant field is required.

Responsibilities

• Design and develop complex IC packaging solutions for multi-die devices.
• Maintain and improve the architecture of the product.
• Provide expertise in IC packaging technologies.

Skills

IC semiconductor packaging

Advanced packaging knowledge

Cadence EDA tools

SI/EMC analysis

Communication skills

Education

Degree in relevant field

Tools

Cadence EDA

Job description

Principal Semiconductor Packaging Engineer, London

Our exciting new technology start-up is currently searching for an experienced, dynamic, and self-starting IC Packaging Engineer to be responsible for the design of complex packaging solutions for multi-die devices.

The role will involve developing and maintaining the architecture of the entire product, as well as providing expertise within the IC packaging domain. Remote and hybrid working arrangements can be offered.

Responsibilities:

• Design and develop complex IC packaging solutions for multi-die devices.
• Maintain and improve the architecture of the product.
• Provide expertise and guidance in IC packaging technologies.

Required Skills:

• Strong experience and knowledge in IC semiconductor packaging.
• Advanced packaging knowledge.
• Experience with Cadence EDA tools.
• SI/EMC analysis experience.
• Excellent communication skills and a start-up mentality.
• Degree qualification in a relevant field.

For further information, please contact Rachel Anderson.