Principal Semiconductor Packaging Engineer

JR United Kingdom; Hounslow; On-site; GBP 60,000 - 80,000; Full time

Job summary

A leading technology client based in Oxford is seeking a Principal Semiconductor Packaging Engineer in south west London. The role focuses on steering packaging roadmaps and developing innovative packaging methods for quantum processors. Candidates should possess significant experience in semiconductor and photonic packaging technologies, alongside strong communication skills.

Qualifications

• Experience in semiconductor/photonic packaging methods.
• Knowledge of die bonding for thermal/mechanical performance.
• Familiarity with 3rd party suppliers.

Responsibilities

• Steer the packaging roadmap for quantum processor devices.
• Develop and produce packaging methods across various frequencies.
• Design and supervise failure analysis experiments.

Skills

Semiconductor packaging methods

Photonic packaging methods

Package substrate technologies

Die bonding methods

Strong communication skills

Job description

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Principal Semiconductor Packaging Engineer, south west london

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Client:

IC Resources

Location:

south west london, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

3

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.