Principal Semiconductor Packaging Engineer

JR United Kingdom; Maidstone; On-site; GBP 50,000 - 80,000; Full time

Job summary

A leading client in Oxford seeks a Principal Semiconductor Packaging Engineer to guide the packaging roadmap for quantum processor devices. This role involves developing innovative packaging methods and collaborating with various partners. The ideal candidate should have extensive experience in semiconductor and photonic packaging techniques.

Qualifications

• Experienced packaging engineer required.
• Knowledge of packaging substrate technologies essential.
• Ability to design and supervise failure analysis experiments.

Responsibilities

• Steering packaging roadmap and collaborating with providers.
• Developing wirebond and bumping methods.
• Supervising thermal performance packaging methods.

Skills

Experience of semiconductor/photonic packaging methods

Knowledge of die bonding methods

Experience working with 3rd party suppliers

Strong internal and external communication skills

Job description

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Principal Semiconductor Packaging Engineer, maidstone

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Client:

IC Resources

Location:

maidstone, United Kingdom

Job Category:

Other

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EU work permit required:

Yes

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Job Views:

3

Posted:

04.06.2025

Expiry Date:

19.07.2025

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Job Description:

Our leading edge Oxford based client is currently searching for an experienced packaging engineer to steer the packaging roadmap, working with internal and external providers to develop and produce quantum processor devices.The role will involve development of wirebond and bumping methods, developing photonics packaging methods across a wide range of frequencies and developing packaging methods for good thermal performance. Designing and supervising failure analysis experiments will also be required.

Required skills for the Principal Packaging Engineer will include:

• Experience of semiconductor/photonic packaging methods and knowledge of package substrate technologies
• Knowledge of die bonding methods for good thermal and mechanical performance
• Experience working with 3rd party suppliers
• Strong internal and external communication skills

Please contact Rachel Anderson for further details.