Principal Packaging Architect: 2.5D/3D & Chiplet Leadership

IC Resources; Wales; On-site; GBP 70,000 - 110,000; Full time

Job summary

IC Resources is seeking a Principal Packaging Engineer to lead and define strategies for advanced 2.5D/3D packaging, heterogeneous integration and next-generation semiconductor systems across AI, HPC, RF, power and photonics. You will provide technical leadership, drive packaging roadmaps and oversee prototyping, qualification and collaboration with customers and partners.

The role requires a strong technical background and proven leadership experience to advance concepts from requirements to

Qualifications

• Strong experience in advanced semiconductor packaging and heterogeneous integration.
• Expertise in 2.5D/3D packaging, chiplets and advanced assembly.

Responsibilities

• Architect advanced 2.5D/3D packaging and heterogeneous integration solutions.
• Lead chiplet, interposer, TSV, high-density interconnect and hybrid bonding development.
• Take packaging concepts from customer requirements through prototyping, demonstrators and qualification.
• Define packaging technology roadmaps and drive long-term innovation.
• Lead multidisciplinary technical projects across design, assembly, thermal and test.
• Develop advanced microelectronic modules and system demonstrators.
• Provide technical leadership across design, validation and qualification.
• Support hands‑on prototyping and laboratory development.
• Contribute to technical proposals, bids and collaborative R&D programmes.
• Manage technical risks and support technology decisions with customers and partners.

Skills

advanced semiconductor packaging and 2

2.5D/3D packaging

Job description

IC Resources is seeking a Principal Packaging Engineer to lead and define strategies for advanced 2.5D/3D packaging, heterogeneous integration and next-generation semiconductor systems across AI, HPC, RF, power and photonics. You will provide technical leadership, drive packaging roadmaps and oversee prototyping, qualification and collaboration with customers and partners.

The role requires a strong technical background and proven leadership experience to advance concepts from requirements to