Senior NPI Packaging Engineer — Semiconductor Solutions

IC Resources; United Kingdom; On-site; GBP 70,000 - 95,000; Full time

Job summary

IC Resources is seeking a Senior NPI Packaging Engineer to lead the development of advanced semiconductor packaging solutions, managing the full product lifecycle from concept through manufacturing handover. You will work with global internal teams and OSAT partners to deliver reliable, scalable, and cost-efficient packaging solutions.

You will develop and optimize packages (wirebond, flip-chip, embedded, DFN/QFN, BGA, SiP, WLCSP), evaluate technologies, and drive supplier development while

Qualifications

• Master’s degree or higher in Electronics, Physics, Materials Science, Engineering, or related field.
• 6 years’ experience in semiconductor packaging/NPI development.
• Strong knowledge of semiconductor assembly processes and package technologies.
• Experience with supplier design rules and 3D CAD tools (AutoCAD).
• Understanding of package thermal characterization.
• Ability to work with global cross-functional teams and external partners.
• Strong ownership, communication, and technical presentation skills.

Responsibilities

• Develop and optimize advanced semiconductor packages (wirebond, flip-chip, embedded, DFN/QFN, BGA, SiP, WLCSP).
• Evaluate packaging technologies and drive supplier/manufacturing partner development.
• Design packages to meet electrical, thermal, and form-factor requirements, including back-end wafer process considerations.
• Improve packaging design processes, tools, and methodologies for efficient NPI delivery.
• Support validation, testing, customer requirements, package drawings, thermal models, and technical documentation.
• Analyze assembly data and communicate technical findings.
• Maintain awareness of industry and academic developments in semiconductor packaging.

Skills

Ownership

Communication

Technical presentation

Education

Master’s degree

Tools

AutoCAD

Cadence Allegro X APD

Klayout

Cadence

Job description

IC Resources is seeking a Senior NPI Packaging Engineer to lead the development of advanced semiconductor packaging solutions, managing the full product lifecycle from concept through manufacturing handover. You will work with global internal teams and OSAT partners to deliver reliable, scalable, and cost-efficient packaging solutions.

You will develop and optimize packages (wirebond, flip-chip, embedded, DFN/QFN, BGA, SiP, WLCSP), evaluate technologies, and drive supplier development while