Director of Semiconductor Packaging

IC Resources; Cambridge; On-site; GBP 120,000 - 150,000; Full time

Job summary

IC Resources is seeking a Director of Semiconductor Packaging to lead the development of high-performance packaging solutions for GaN power semiconductors in Cambridge. The role blends technical leadership with people leadership and hands-on engineering to set strategy and build team capability.

You will work with internal teams and external packaging/manufacturing partners, drive DMF/DFM discipline, and shape the product and technology roadmap while representing the latest advances in

Qualifications

• Experience designing high-volume power packages for GaN or similar tech.
• Ability to lead cross-functional teams and external suppliers.
• Experience with package verification and reliability testing.
• Strong communication and presentation skills.

Responsibilities

• Lead the design and development of high-performance, high-density semiconductor packages for GaN power products.
• Develop technologies including wirebond, flip-chip, embedded packaging and wafer back-end processes.
• Balance electrical, thermal, mechanical, cost, quality and form-factor requirements.
• Lead packaging development with overseas assembly houses and technology suppliers.
• Support package verification, qualification, reliability and thermal testing.
• Drive design-for-manufacture, design processes and engineering tools to right-first-time designs.
• Conduct first-article inspection and failure analysis.
• Provide packaging expertise to Applications Engineering and customers.
• Contribute significantly to the product and technology roadmap.
• Build external networks and maintain awareness of state-of-the-art semiconductor packaging.

Skills

Semiconductor packaging design

Power electronics

Overseas assembly houses experience

3D CAD & DFM

Thermal management

Supplier management

Leadership

Education

Degree in Engineering/Physics/Materials Science

Tools

3D CAD tools (SolidWorks/Creo)

COMSOL/ANKSYS or similar

DFM/DFX practices

Job description

A growing semiconductor client is currently seeking a Director of Semiconductor Packaging to lead the development of advanced, high-performance packaging solutions for GaN power semiconductors.

The role combines technical leadership, people leadership and hands-on engineering. The successful candidate will set the packaging strategy, build team capability, influence company-wide decisions and work closely with internal teams and external packaging/manufacturing partners.

Key Responsibilities

• Lead the design and development of high-performance, high-density semiconductor packages for GaN power products.
• Develop technologies including wirebond, flip-chip, embedded packaging and wafer back-end processes.
• Balance electrical, thermal, mechanical, cost, quality and form-factor requirements.
• Lead packaging development with overseas assembly houses and technology suppliers.
• Support package verification, qualification, reliability and thermal testing.
• Drive design-for-manufacture, design processes and engineering tools to achieve right-first-time designs.
• Conduct first-article inspection and failure analysis.
• Provide packaging expertise to Applications Engineering and customers.
• Contribute significantly to the product and technology roadmap.
• Build external networks and maintain awareness of state-of-the-art semiconductor packaging.

Essential Experience & Skills

• Degree or higher in Engineering, Physics, Materials Science or a related discipline.
• Strong experience designing and manufacturing high-volume semiconductor power packages, including working with overseas assembly houses.
• Deep knowledge of packaging technologies including:
• Flip-chip
• PCB embedding
• Strong 3D CAD experience and knowledge of supplier design rules/DFM.
• Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent.
• Experience with thermal characterisation of semiconductor packages.
• Experience with package qualification/reliability testing, including TCoB, MSL, TC, HAST and HTS, against relevant standards.
• Strong cross-functional leadership and supplier-management skills.
• Ability to manage priorities independently and deliver results.
• Confident presenting technical results to internal and external stakeholders.

Please contact Rachel Anderson for further details.