Director of Semiconductor Packaging

Intellectual Capital Resources Ltd; Cambridgeshire and Peterborough; On-site; GBP 140,000 - 200,000; Full time

Job summary

Intellectual Capital Resources Ltd. seeks a Director of Semiconductor Packaging to lead the development of advanced GaN packaging solutions. You will set strategy, build team capability and collaborate with internal teams and external partners to drive innovative, reliable, high‑density packages.

You will direct die attach, flip‑chip, wire bonding and embedded packaging work, while guiding verification, qualification and thermal testing to meet stringent performance targets.

Qualifications

• Degree or higher in Engineering, Physics, Materials Science or a related discipline.
• Strong experience designing and manufacturing high‑volume power packages, with overseas assembly houses.
• Deep knowledge of packaging technologies including die attach/Ag‑sintering, flip‑chip, wire bonding, copper clip, PCB embedding, chip metallisation.

Responsibilities

• Lead design and development of high‑performance semiconductor packages for GaN power products.
• Develop packaging technologies including wirebond, flip‑chip, embedded packaging and wafer back‑end processes.
• Balance electrical, thermal, mechanical, cost and form‑factor requirements.
• Lead packaging development with overseas assembly houses and technology suppliers.
• Support package verification, qualification, reliability and thermal testing.
• Drive design‑for‑manufacture and use of engineering tools for right‑first‑time designs.
• Conduct first‑article inspection and failure analysis.
• Provide packaging expertise to Applications Engineering and customers.
• Contribute to product and technology roadmap.
• Build external networks and stay updated on state‑of‑the‑art semiconductor packaging

Skills

High-volume packaging design

Overseas supplier management

3D CAD

Multiphysics/FEA simulations

Thermal characterization

Education

Degree or higher in Engineering/Physics/Materials Science

Tools

COMSOL

ANSYS

Job description

A growing semiconductor client is currently seeking a Director of Semiconductor Packaging to lead the development of advanced, high-performance packaging solutions for GaN power semiconductors. The role combines technical leadership, people leadership and hands‑on engineering. The successful candidate will set the packaging strategy, build team capability, influence company-wide decisions and work closely with internal teams and external packaging/manufacturing partners.

Key Responsibilities

• Lead the design and development of high-performance, high-density semiconductor packages for GaN power products
• Develop technologies including wirebond, flip-chip, embedded packaging and wafer back‑end processes
• Balance electrical, thermal, mechanical, cost, quality and form‑factor requirements
• Lead packaging development with overseas assembly houses and technology suppliers
• Support package verification, qualification, reliability and thermal testing
• Drive design‑for‑manufacture, design processes and engineering tools to achieve right‑first‑time designs
• Conduct first‑article inspection and failure analysis
• Provide packaging expertise to Applications Engineering and customers
• Contribute significantly to the product and technology roadmap
• Build external networks and maintain awareness of state‑of‑the‑art semiconductor packaging

Essential Experience & Skills

• Degree or higher in Engineering, Physics, Materials Science or a related discipline
• Strong experience designing and manufacturing high‑volume semiconductor power packages, including working with overseas assembly houses
• Deep knowledge of packaging technologies including:
  • Die attach / Ag‑sintering
  • Flip‑chip
  • Wire bonding
  • Copper clip
  • PCB embedding
  • Chip metallisation
• Strong 3D CAD experience and knowledge of supplier design rules/DFM
• Strong 3D multiphysics/FEA simulation experience using tools such as COMSOL, ANSYS or equivalent
• Experience with thermal characterisation of semiconductor packages
• Experience with package qualification/reliability testing, including TCoB, MSL, TC, HAST and HTS, against relevant standards
• Strong cross‑functional leadership and supplier‑management skills
• Ability to manage priorities independently and deliver results
• Confident presenting technical results to internal and external stakeholders