GaN Power Packaging Director — Lead Strategy & Innovation

Intellectual Capital Resources Ltd; Cambridgeshire and Peterborough; On-site; GBP 140,000 - 200,000; Full time

Job summary

Intellectual Capital Resources Ltd. seeks a Director of Semiconductor Packaging to lead the development of advanced GaN packaging solutions. You will set strategy, build team capability and collaborate with internal teams and external partners to drive innovative, reliable, high‑density packages.

You will direct die attach, flip‑chip, wire bonding and embedded packaging work, while guiding verification, qualification and thermal testing to meet stringent performance targets.

Qualifications

• Degree or higher in Engineering, Physics, Materials Science or a related discipline.
• Strong experience designing and manufacturing high‑volume power packages, with overseas assembly houses.
• Deep knowledge of packaging technologies including die attach/Ag‑sintering, flip‑chip, wire bonding, copper clip, PCB embedding, chip metallisation.

Responsibilities

• Lead design and development of high‑performance semiconductor packages for GaN power products.
• Develop packaging technologies including wirebond, flip‑chip, embedded packaging and wafer back‑end processes.
• Balance electrical, thermal, mechanical, cost and form‑factor requirements.
• Lead packaging development with overseas assembly houses and technology suppliers.
• Support package verification, qualification, reliability and thermal testing.
• Drive design‑for‑manufacture and use of engineering tools for right‑first‑time designs.
• Conduct first‑article inspection and failure analysis.
• Provide packaging expertise to Applications Engineering and customers.
• Contribute to product and technology roadmap.
• Build external networks and stay updated on state‑of‑the‑art semiconductor packaging

Skills

High-volume packaging design

Overseas supplier management

3D CAD

Multiphysics/FEA simulations

Thermal characterization

Education

Degree or higher in Engineering/Physics/Materials Science

Tools

COMSOL

ANSYS

Job description

Intellectual Capital Resources Ltd. seeks a Director of Semiconductor Packaging to lead the development of advanced GaN packaging solutions. You will set strategy, build team capability and collaborate with internal teams and external partners to drive innovative, reliable, high‑density packages.

You will direct die attach, flip‑chip, wire bonding and embedded packaging work, while guiding verification, qualification and thermal testing to meet stringent performance targets.