Senior Optical Packaging Engineer: Scale Fibre-to-Chip

PsiQuantum

Daresbury

On-site

GBP 70,000 - 100,000

Full time

8 days ago

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Job summary

PsiQuantum’s UK R&D facility located in Daresbury Lab is seeking a Senior Optical Packaging Engineer to develop high-performance, scalable opto-electronic packaging workflows for chip-based photonic ICs. The role is based at PsiQuantum’s UK R&D facility in Daresbury Lab.

You will lead the design and implementation of optical packaging schemes, manage prototypes and scalable assembly flows, and collaborate with suppliers and external vendors to translate successful prototypes into scalable

Qualifications

Master’s degree or higher in Optical Engineering, Physics or an equivalent field.
3+ years in PIC packaging design and qualification.
5+ years of experience with optical fibers and optical measurements.
3+ years in FAU / optical connector to chip attachment.
Experience with optical data analysis.

Responsibilities

Develop an optical package and fibre-to-chip alignment scheme with high alignment accuracy.
Develop packaging prototypes and scalable fibre-to-chip packaging flows.
Review packaging BOMs and coordinate parts procurement.
Collaborate with internal packaging team and external vendors to scale designs.
Source materials with external partners and provide feedback on evolving requirements.
Work with external partners on advanced opto-electronic packaging solutions.