Cryogenic 3D Packaging Lead for Quantum Modules

Jobtailor; Greater London; On-site; GBP 120,000 - 180,000; Full time

Job summary

Jobtailor seeks a senior packaging and R&D leader to drive 3D integration for multi-chip quantum modules. You will build and guide a team across packaging, signal integrity, materials, and quantum integration, coordinating with external foundries and research partners to deliver robust, cryogenic-ready solutions.

Your work will balance rapid prototyping with rigorous reliability, yield, and long-term stability, partnering with design, process integration, cryo R&D, and quantum hardware teams.

Qualifications

• Advanced degree with 7+ years in 3D integration and packaging.
• Experience leading multi-disciplinary engineering teams.
• Proven ability to transfer designs to external manufacturing partners.

Responsibilities

• Lead R&D for complex, multi-chip quantum modules and packaging.
• Oversee tech transfers with foundries and OSATs.
• Drive rapid prototyping while improving yield and reliability.
• Coordinate with cryo R&D and quantum teams on co-optimised designs.

Skills

3D integration

TSVs

microbumps

flip-chip bonding

team leadership

external foundries coordination

simulation tools HFSS/Q3D Cadence

cryogenic electronics

quantum hardware packaging

low-temperature materials behavior

Education

Master’s or PhD in Electrical Engineering or related field

Tools

Ansys HFSS

Q3D

Cadence

Job description

Jobtailor seeks a senior packaging and R&D leader to drive 3D integration for multi-chip quantum modules. You will build and guide a team across packaging, signal integrity, materials, and quantum integration, coordinating with external foundries and research partners to deliver robust, cryogenic-ready solutions.

Your work will balance rapid prototyping with rigorous reliability, yield, and long-term stability, partnering with design, process integration, cryo R&D, and quantum hardware teams.