Hybrid Principal Packaging Engineer - 2.5D/3D Integration Leader

IC Resources; Wales; Hybride; GBP 90 000 - 130 000; Plein temps

Avantages offerts par ce poste

Sponsorship

Relocation assistance

Company pension

Private healthcare

Hybrid work schedule

Work-life balance

Résumé du poste

IC Resources seeks a Principal Packaging Engineer to drive advanced packaging architecture and heterogeneous integration for next-generation semiconductor systems across AI, HPC, RF, power and photonics. You will lead cross-functional teams and mentor engineers while shaping roadmaps and technical strategy.

The role demands deep experience in packaging development, leadership capabilities and a track record in delivering prototypes, demos and qualification across multidisciplinary projects.

Qualifications

• Experience in advanced semiconductor packaging and heterogeneous integration.
• Proven track record leading packaging development projects.
• Understanding of full packaging lifecycle from design through qualification.
• Strong leadership and communication skills.

Responsabilités

• Architect 2.5D/3D packaging and heterogeneous integration solutions.
• Lead chiplet, interposer, TSV, high-density interconnect and hybrid bonding development.
• Translate customer requirements into prototypes, demonstrators and qualification.
• Define packaging technology roadmaps and drive long-term innovation.
• Lead multidisciplinary technical projects across design, assembly, thermal and test.
• Develop advanced microelectronic modules and system demonstrators.
• Provide technical leadership across design, validation and qualification.
• Support hands-on prototyping and laboratory development.
• Contribute to technical proposals, bids and collaborative R&D programmes.
• Manage technical risks and support technology decisions with customers and partners.

Connaissances

Advanced packaging

Heterogeneous integration

2.5D/3D packaging

Leadership

Chiplets/Interposers/TSV

Power & signal integrity

Description du poste

IC Resources seeks a Principal Packaging Engineer to drive advanced packaging architecture and heterogeneous integration for next-generation semiconductor systems across AI, HPC, RF, power and photonics. You will lead cross-functional teams and mentor engineers while shaping roadmaps and technical strategy.

The role demands deep experience in packaging development, leadership capabilities and a track record in delivering prototypes, demos and qualification across multidisciplinary projects.