Advanced Packaging Architect – Equity & Impact

OLIX; West of England; On-site; GBP 110,000 - 170,000; Full time

Benefits offered by this job

Equity & Ownership

Proximity Bonus

Job summary

OLIX is seeking an Advanced Packaging Architect to own the packaging architecture across DX-1 and future products. You will lead 2.5D/3D packaging, define design rules, and manage the full packaging flow from concept to manufacturing, while building a capable team.

In this high-impact role you will collaborate with ASIC, optics, mechanical, and OSAT partners, shaping system-level integration and roadmaps in a fast-paced, technology-focused environment.

Qualifications

• 10+ years’ experience in advanced semiconductor packaging.
• Ownership of packaging architecture, technology strategy, or roadmap.
• Strong leadership and mentoring abilities.
• Experience leading package development across layout, simulation, and release.

Responsibilities

• Own package architecture and design for ASIC-to-substrate integration.
• Direct full package design flow from concept through manufacturing.
• Lead PI/SI simulations and translate results into design decisions.
• Collaborate with vendors and internal teams to ensure manufacturability and reliability.

Skills

Semiconductor packaging

2.5D/3D packaging

PI/SI simulation

Packaging architecture

Team leadership

Education

Degree in engineering or physical sciences

Tools

Cadence Allegro X APD

Siemens Xpedition

Job description

OLIX is seeking an Advanced Packaging Architect to own the packaging architecture across DX-1 and future products. You will lead 2.5D/3D packaging, define design rules, and manage the full packaging flow from concept to manufacturing, while building a capable team.

In this high-impact role you will collaborate with ASIC, optics, mechanical, and OSAT partners, shaping system-level integration and roadmaps in a fast-paced, technology-focused environment.