Principal Advanced Packaging Engineer: Lead FlexIC Packaging

PragmatIC Semiconductor

Tees Valley

On-site

GBP 90,000 - 120,000

Full time

8 days ago

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Job summary

Pragmatic Semiconductor is seeking a Principal Advanced Packaging Engineer to lead the technical development of FlexIC wafer-level and chip-scale packaging, die attachment, and system integration across Sedgefield and Durham sites. The role requires deep experience in semiconductor packaging, MEMS/flexible electronics, and cross-functional collaboration.

Visa sponsorship and relocation assistance are available.

Qualifications

Degree or postgraduate qualification in a relevant discipline such as Electronic Engineering, Mechanical Engineering, Materials Science, Physics or MEMS.
Project Management qualifications would be beneficial but not essential.

Responsibilities

Lead the technical development of FlexIC wafer-level packaging (WLP), wafer-level chip-scale packaging (WLCSP), die attachment and System in Package integration processes.
Deliver robust FlexIC packaging solutions meeting technical, reliability, manufacturability and programme requirements.
Set technical direction, priorities and development plans including materials, processes, suppliers and external partners.
Provide specialist packaging and assembly expertise across FlexIC interconnects development streams, including wafer debonding process development.
Establish and validate scalable approaches with clear process windows and documented results.
Make day-to-day technical decisions and coordinate priorities across R&D, Engineering, Operations and external partners.