Senior NPI Packaging Engineer - Semiconductors

Intellectual Capital Resources Ltd; West of England; On-site; GBP 70,000 - 110,000; Full time

Job summary

Intellectual Capital Resources Ltd. seeks a Senior NPI Packaging Engineer to drive advanced semiconductor packaging from concept through manufacturing handover. You will collaborate with global teams and OSAT partners to deliver reliable, scalable, and cost-effective packaging solutions.

The role requires a Master’s degree and ~6 years of packaging/NPI experience, with strong knowledge of CAD tools and thermal packaging. Fluent English and strong communication are essential.

Qualifications

• Master’s degree or higher in Electronics, Physics, Materials Science, Engineering, or related field.
• ~6 years’ experience in semiconductor packaging/NPI development.
• Strong knowledge of semiconductor assembly processes and package technologies.
• Experience with supplier design rules and 3D CAD tools (AutoCAD).
• Understanding of package thermal characterization.
• Ability to work with global cross-functional teams and external partners.
• Strong ownership, communication, and technical presentation skills.
• Fluent English communication skills.

Responsibilities

• Develop and optimize advanced semiconductor packages (wirebond, flip-chip, embedded, DFN/QFN, BGA, SiP, WLCSP).
• Evaluate packaging technologies and drive supplier/manufacturing partner development.
• Design packages to meet electrical, thermal, and form-factor requirements, including back-end wafer process considerations.
• Improve packaging design processes, tools, and methodologies for efficient NPI delivery.
• Support validation, testing, customer requirements, package drawings, thermal models, and technical documentation.
• Analyze assembly data and communicate technical findings.
• Maintain awareness of industry and academic developments in semiconductor packaging.

Skills

Semiconductor packaging & NPI

English communication

Global cross-functional teamwork

Technical presentation

Education

Master’s degree or higher in Electronics/Physics/Materials Science/Engineering

Tools

AutoCAD

Cadence Allegro X APD

Klayout

Job description

Intellectual Capital Resources Ltd. seeks a Senior NPI Packaging Engineer to drive advanced semiconductor packaging from concept through manufacturing handover. You will collaborate with global teams and OSAT partners to deliver reliable, scalable, and cost-effective packaging solutions.

The role requires a Master’s degree and ~6 years of packaging/NPI experience, with strong knowledge of CAD tools and thermal packaging. Fluent English and strong communication are essential.