Senior Engineer, Advanced Packaging & Wafer Bonding

Imec; Vlaams-Brabant; Remote; EUR 120,000 - 170,000; Full time

Job summary

IMEC seeks a Principal Engineer for Advanced Packaging to leverage broad, in-depth expertise in wafer bonding and packaging processes within the semiconductor field. You will coach the team, set up efficient processes, and translate area needs into strategic roadmaps for ongoing development.

You will stay current with new technologies, build cross-group collaborations, and act as a technical spokesperson across fora, guiding long-term initiatives and market exploration for tool acquisitions.

Qualifications

• Master's degree + 10+ years in semiconductor industry related to wafer bonding & advanced packaging.
• Strong technical, hands-on and scientific background.
• Experience with device integration and the different process steps to build these devices.

Responsibilities

• Provide strategic technical leadership and translate area/ FAB needs into roadmaps.
• Coach and develop the team to raise process maturity and improve ways of working.
• Collaborate with internal/external customers and industry partners to drive tool acquisitions and innovations.
• Occasionally publish results in journals and conferences to share advancements.

Skills

Wafer bonding & advanced packaging

Education

Master’s degree in Applied Sciences or equivalent

Job description

IMEC seeks a Principal Engineer for Advanced Packaging to leverage broad, in-depth expertise in wafer bonding and packaging processes within the semiconductor field. You will coach the team, set up efficient processes, and translate area needs into strategic roadmaps for ongoing development.

You will stay current with new technologies, build cross-group collaborations, and act as a technical spokesperson across fora, guiding long-term initiatives and market exploration for tool acquisitions.