Process Engineer, Semi-Additive 3D Packaging

Imec; Vlaams-Brabant; Remote; EUR 70,000 - 90,000; Full time

Job summary

imec is seeking a Process Engineer for Semi-Additive Manufacturing to advance temporary bonding/debonding processes in 3D-heterogeneous packaging applications. You will work in the Bonding, Assembly and Wafer level packaging team (BAW) within the Materials, Transfer and Assembly group (MATA) at imec’s Leuven, Belgium site, collaborating with researchers, engineers and external partners.

You will define new processes, develop metrology, perform materials characterization, and contribute to imec’s

Qualifications

• Master’s degree in chemistry, physics, materials science or engineering.
• PhD or relevant industrial/research experience is a plus.
• Experience with wafer-to-wafer bonding and semiconductor materials.
• Strong data analysis skills with scripts (Matlab, Python) and JMP.
• Ability to work independently in clean room; cross-functional collaboration.

Responsibilities

• Define, organize, set up and validate new temporary bonding/debonding processes including local deposition processes using semi-additive manufacturing techniques.
• Identify metrology solutions to characterize these processes.
• Contribute to research programs and joint development with external partners.
• Collaborate cross-functionally with integration, process support, and hardware teams, and with industrial partners.
• Report work to internal/external partners and via conference/journal publications.
• Initiate fundamental research on new materials and perform characterization and failure analysis.
• Monitor industry trends and adapt to imec programs and activities.
• Coordinate transfer of developed processes and tools to support/operational teams in imec’s fab.
• Initiate and oversee start-up of new equipment.

Skills

Data analysis

Project management

Independent working

Teamwork

Communication

Education

Master’s degree in chemistry, physics, materials science or engineering

Tools

MATLAB

Python

JMP

Job description

imec is seeking a Process Engineer for Semi-Additive Manufacturing to advance temporary bonding/debonding processes in 3D-heterogeneous packaging applications. You will work in the Bonding, Assembly and Wafer level packaging team (BAW) within the Materials, Transfer and Assembly group (MATA) at imec’s Leuven, Belgium site, collaborating with researchers, engineers and external partners.

You will define new processes, develop metrology, perform materials characterization, and contribute to imec’s