Advanced 3D Packaging Integration Lead

imec; Vlaams-Brabant; On-site; EUR 110,000 - 170,000; Full time

Job summary

IC-Link by imec seeks an Advanced 3D Packaging Integration Lead to define and drive the technical roadmap for imec’s 3D packaging platform, bringing advanced integration technologies from development into manufacturing-ready solutions.

You will lead development and industrialization of imec's 3D packaging platform in current semiconductor facilities, define and optimize flows for interposers, microbumps, redistribution layers, TSVs, and die-to-wafer bonding, and ensure platform readiness through

Qualifications

• Master's or PhD in a relevant field.
• 10+ years of semiconductor industry experience.
• Strong experience with wafer-level 3D integration and advanced packaging processes.

Responsibilities

• Define and drive the technical roadmap for IC-Link imec’s 3D packaging platform.
• Lead development and industrialization of the platform in current fabrication facilities.
• Define and optimize integration flows for silicon interposers, microbumps, redistribution layers, TSVs, and bonding.
• Drive platform readiness through test vehicles and customer programs.
• Collaborate with fab, test and assembly partners to ensure platform adoption.

Skills

Leadership

Stakeholder management

Project management

Communication

Education

Master's degree in semiconductor engineering

PhD in a related field

Tools

EDA tools

Process design kits

Job description

Turn groundbreaking 3D integration technologies into a manufacturing-ready platform for next-generation semiconductor products.

Advanced packaging is reshaping how complex semiconductor systems are designed and manufactured. At IC-Link by imec, you will lead the integration of technologies such as silicon interposers, fine-pitch microbumps, redistribution layers, through-silicon vias and advanced bonding technologies into a coherent platform for prototyping and manufacturing.

You will work at the intersection of technology development, semiconductor manufacturing, design enablement and the global packaging supply chain. Your goal will be clear: make imec's originated advanced 3D integration technologies ready for reliable use by customers and manufacturing partners.

IC-Link by imec is imec's chip development and manufacturing services division. We help start-ups, universities, SMEs and established technology companies move from an innovative chip concept to a qualified, manufacturable product. Our services cover chip design, packaging, testing, qualification and supply chain management.

What you will do

As Advanced 3D Packaging Integration Lead, you will define and drive the technical roadmap for IC-Link imec’s 3D packaging platform, bringing advanced integration technologies from development into manufacturing-ready solutions.

More specifically, you will:

• Lead the development and industrialization of imec's advanced 3D packaging platform in current and future semiconductor fabrication facilities.
• Define and optimize integration flows for technologies such as silicon interposers, microbumps, redistribution layers, through-silicon vias, die-to-wafer bonding and wafer-to-wafer bonding.
• Drive platform readiness through test vehicles, customer programs and continuous process improvements.
• Ensure that process design kits and assembly design guidelines are developed and maintained to support successful platform adoption.
• Align the platform with the broader manufacturing ecosystem, including fab, test and outsourced assembly and test partners.
• Collaborate with experts across process integration, design, manufacturing, testing and reliability to resolve technical challenges and support industrialization.
• Represent imec towards customers and partners by presenting the platform roadmap, benchmarking industry developments and supporting technology transfers to manufacturing partners.

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.

Who you are

You are an experienced semiconductor professional who combines deep technical expertise with the ability to guide multidisciplinary teams and engage confidently with customers and manufacturing partners.

To succeed in this role, you bring:

• A master's degree or PhD in semiconductor engineering, microelectronics, materials science, electrical engineering or a related field.
• More than 10 years of relevant experience in a semiconductor foundry, manufacturing or advanced packaging environment.
• Strong experience with wafer-level 3D integration and advanced packaging process flows.
• Practical knowledge of technologies such as redistribution layers, microbumps, silicon interposers, through-silicon vias, die-to-wafer bonding or wafer-to-wafer bonding.
• The ability to discuss complex process and integration challenges with fab engineers, designers, test specialists and manufacturing partners.
• Experience translating technology development into manufacturing requirements and roadmap decisions.
• Strong stakeholder management and project leadership skills.
• The confidence to represent imec in customer meetings and discussions with international semiconductor partners.
• Excellent written and spoken English.

Experience working with outsourced semiconductor assembly and test partners is strongly valued. Familiarity with electronic design automation tools and the development or use of process design kits is considered an advantage.

You do not need to have experience with every technology listed above

What matters most is that you understand advanced semiconductor integration, can connect expertise across disciplines and know how to move a complex technology platform towards manufacturing.