Die-to-Wafer Bonding R&D Specialist

Imec India Private Limited; Heverlee; Sur place; EUR 65 000 - 90 000; Plein temps

Résumé du poste

IMEC in Leuven is seeking an R&D Process Engineer for Die-to-Wafer bonding to join the MAT team. You will develop, optimize, and validate D2W bonding processes, with significant time in the cleanroom, collaborating with researchers, process engineers, equipment partners, and stakeholders.

You hold a Master’s degree in Physics, Chemistry, Materials Science, or Engineering, enjoy team work and independent work, and are fluent in English.

Qualifications

• Master’s degree in Physics, Chemistry, Materials Science, Engineering, or related field.
• Fluent in written and spoken English.
• Hands-on in a semiconductor cleanroom environment is desirable.
• Experience with bonding, plasma, CMP or cleaning processes is advantageous.

Responsabilités

• Organizing and executing D2W bonding process development activities.
• Developing, optimizing, and validating bonding processes using metrology techniques.
• Analyzing and summarizing experimental results with focus on process optimization.
• Reporting progress and opportunities to stakeholders and leadership.
• Hands-on involvement in the cleanroom and ownership of the bonding process flow.
• Collaborating across teams to enable successful process development.

Connaissances

Data analysis

Python

MATLAB

C/C++

COMSOL

Formation

Master's degree in Physics/Engineering/Materials Science

Description du poste

IMEC in Leuven is seeking an R&D Process Engineer for Die-to-Wafer bonding to join the MAT team. You will develop, optimize, and validate D2W bonding processes, with significant time in the cleanroom, collaborating with researchers, process engineers, equipment partners, and stakeholders.

You hold a Master’s degree in Physics, Chemistry, Materials Science, or Engineering, enjoy team work and independent work, and are fluent in English.