Advanced 3D Packaging Platform Lead

imec

Vlaams-Brabant

On-site

EUR 110,000 - 170,000

Full time

10 hours ago

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Job summary

IC-Link by imec seeks an Advanced 3D Packaging Integration Lead to define and drive the technical roadmap for imec’s 3D packaging platform, bringing advanced integration technologies from development into manufacturing-ready solutions.

You will lead development and industrialization of imec's 3D packaging platform in current semiconductor facilities, define and optimize flows for interposers, microbumps, redistribution layers, TSVs, and die-to-wafer bonding, and ensure platform readiness through

Qualifications

Master's or PhD in a relevant field.
10+ years of semiconductor industry experience.
Strong experience with wafer-level 3D integration and advanced packaging processes.

Responsibilities

Define and drive the technical roadmap for IC-Link imec’s 3D packaging platform.
Lead development and industrialization of the platform in current fabrication facilities.
Define and optimize integration flows for silicon interposers, microbumps, redistribution layers, TSVs, and bonding.
Drive platform readiness through test vehicles and customer programs.
Collaborate with fab, test and assembly partners to ensure platform adoption.