Senior 3D/BEOL Packaging Integration Engineer

imec; Vlaams-Brabant; Sur place; EUR 90 000 - 130 000; Plein temps

Résumé du poste

Imec's R&D headquarters in Leuven hosts the BEOL Platform team, focusing on 3D, memory and interconnect projects. This role targets an experienced Advanced Packaging (3D) Integration engineer who will drive process improvements and technical ownership in a collaborative, high‑tech environment.

You will lead development plans, run inline characterization, coordinate pilot lines, and mentor colleagues while contributing to strategic program goals across imec’s platforms.

Qualifications

• Master's Degree in Engineering or science field.
• 7+ years of industry experience in production or technology development.
• Experience with die‑to‑wafer bonding and chip interposers; BEOL Cu damascene is a plus.
• Proven ability to take technical ownership of a complex project and solve problems.
• Strong data analysis and data‑driven decision making.
• Excellent time management and ability to balance multiple projects.
• Excellent written and spoken English; strong cross‑group communication.

Responsabilités

• Contribute in Platform Integration Group on diverse imec projects.
• Advance platformisation or stabilisation of flows within BEOL or 3D integration.
• Define experiments, inline characterization, and monitor pilot line processing.
• Define development plans with process engineers and manage cycle time in 300mm cleanroom.
• Window and test modules to establish optimal settings across programs.
• Mentor teammates after training and take ownership of large Platform projects.
• Opportunity to progress from R&D Engineer to Principal staff based on background.

Connaissances

Problem solving

Data analysis

Time management

Communication

Initiative

Organization

English proficiency

Formation

Master's degree in Engineering or science

Description du poste

Imec's R&D headquarters in Leuven hosts the BEOL Platform team, focusing on 3D, memory and interconnect projects. This role targets an experienced Advanced Packaging (3D) Integration engineer who will drive process improvements and technical ownership in a collaborative, high‑tech environment.

You will lead development plans, run inline characterization, coordinate pilot lines, and mentor colleagues while contributing to strategic program goals across imec’s platforms.