R&D Die-to-Wafer bonding step developer

Imec India Private Limited; Heverlee; Sur place; EUR 65 000 - 90 000; Plein temps

Résumé du poste

IMEC in Leuven is seeking an R&D Process Engineer for Die-to-Wafer bonding to join the MAT team. You will develop, optimize, and validate D2W bonding processes, with significant time in the cleanroom, collaborating with researchers, process engineers, equipment partners, and stakeholders.

You hold a Master’s degree in Physics, Chemistry, Materials Science, or Engineering, enjoy team work and independent work, and are fluent in English.

Qualifications

• Master’s degree in Physics, Chemistry, Materials Science, Engineering, or related field.
• Fluent in written and spoken English.
• Hands-on in a semiconductor cleanroom environment is desirable.
• Experience with bonding, plasma, CMP or cleaning processes is advantageous.

Responsabilités

• Organizing and executing D2W bonding process development activities.
• Developing, optimizing, and validating bonding processes using metrology techniques.
• Analyzing and summarizing experimental results with focus on process optimization.
• Reporting progress and opportunities to stakeholders and leadership.
• Hands-on involvement in the cleanroom and ownership of the bonding process flow.
• Collaborating across teams to enable successful process development.

Connaissances

Data analysis

Python

MATLAB

C/C++

COMSOL

Formation

Master's degree in Physics/Engineering/Materials Science

Description du poste

R&DDie-to-Wafer bondingstep developer

What you will do

Die-to-Wafer (D2W) bonding is a key enabling technology for advanced packaging and heterogeneous integration. It allows the integration of dies from different technology nodes, materials, sizes, and thicknesses. Direct dielectric and hybrid copper/dielectric bonding are increasingly adopted because they enable highlyaccurateoverlay alignment through low-force, room-temperature bonding processes.

As part of theMAterialTransfer (MAT) team, you will contribute to the development and optimization of advanced D2W bonding processes. A significant part of your work will take place in the cleanroom, where you will collaborate closely with R&D engineers to develop, execute, and improve bonding processes.

You will support multiplecutting-edgeresearch programs in areas such as 3D integration, Optical I/O,imagers, memory…You will work in a dynamic, multidisciplinary, and international environment together with researchers, process engineers, equipment suppliers, industrial partners, and device experts.

As an R&D Process Engineer for D2W bonding, you will play a key role in achieving the team’s technicalobjectives. Your responsibilities will include:

• Organizing and executing D2W bonding process development activities
• Developing,optimizing, andvalidatingbonding processes using associated metrology techniques (e.g. overlay measurements, void inspection, bond quality analysis)
• Analysingand summarizing experimental results, with a focus on process optimization and performance improvement
• Reporting progress, results, and opportunities to different stakeholders and organizational levels
• Taking an active hands‑on role in the cleanroom and contributing to the ownership and maturity of the bonding process flow
• Collaborating across teams, including integration, hardware, operations, and support groups, to enable successful process development

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.

Who you are

• You hold aMaster’s degree in Physics, Chemistry, Materials Science, Engineering, or a related field.
• You enjoy working in a collaborative team environment while also being able to work independently when needed
• You are motivated to work in a highly innovative and international R&D environment
• You are fluent in written and spoken English
• You are eager to work hands‑on in a semiconductor cleanroom environment
• Experience with bonding, plasma,CMPor cleaningprocesses is considered anadvantage
• Experience with data analysis, simulation, ormodellingtools (e.g. Python, MATLAB, C/C++, COMSOL) is aplus
• Experience with bonding‑related metrology techniques is a plus
• You are analytical, solution‑oriented, and passionate about process development and data interpretation
• You work in a structured, organized, and methodical way

IMEC and its affiliates will not accept unsolicited resumes from any source other than directly from a candidate. IMEC will consider unsolicited referrals and/or resumes submitted by vendors such as search firms, staffing agencies, professional recruiters, fee‑based referral services and recruiting agencies (hereafter “Agency”) to have been referred by the Agency free of charge. IMEC will not pay a fee to any Agency that does not have a prior written agreement with IMEC, validated by its HR department, in place regarding a specific job opening and allowing to submit resumes.