Semi-Additive Process Engineer for 3D IC Packaging

Imec

Vlaams-Brabant

Sur place

EUR 65 000 - 90 000

Plein temps

Il y a 2 jours

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Résumé du poste

imec in Leuven, Belgium is seeking a Process Engineer for Semi-Additive Manufacturing to develop and validate new temporary bonding/debonding processes with a focus on 3D-heterogeneous packaging applications. You will work in a multidisciplinary BAW team within MATA, coordinating with researchers, hardware engineers and suppliers to advance packaging technologies and publish results.

The role requires a master’s degree (PhD a bonus), strong data analysis skills (Matlab/Python) and the ability to

Qualifications

Master’s degree in chemistry, physics, materials science or engineering.
PhD or relevant experience in research or industry is an advantage.
Knowledge of data analysis and scripting (Matlab, Python) is desirable.

Responsabilités

Define, organize, set up and validate new temporary bonding/debonding processes including local deposition using semi-additive manufacturing.
Identify metrology solutions to characterize these processes.
Engage in joint development programs with external partners.
Collaborate with integration/process support/hardware teams and industrial partners.
Present findings to internal and external partners and publish in journals/conferences.