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ams OSRAM’s LSP unit seeks a senior leader to drive Pod & Wafer Handling operations. You will lead Maintenance Engineers and FLM Technicians, champion uptime, MTTR/MTBF improvements, and coordinate with Process, Engineering, and Facility teams to optimize productivity.
You will guide tool capacity planning and oversee continuous improvement projects, while ensuring compliance with the EEI collective agreements and company standards. Proficiency in German and English is required.
We are LSP - Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing - combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems -driving performance, scalability, and innovation in high-growth segments.
We offer competitive salaries and additional benefits based on your performance, experience and qualification.
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group G (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/). We offer a higher compensation depending on your expertise and skills.