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ams-OSRAM AG in Austria seeks a technically skilled professional for single process ownership in mechanical wafer processing, covering backgrinding, bonding, sawing and debonding. You will apply SPC, FDC and support production goals, with ongoing process documentation and improvements.
Requirements include an HTL (Higher Technical College), strong German and English, and a proactive, independent work style within cross-functional teams.
We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.
We offer competitive salaries and additional benefits based on your performance, experience and qualification.
The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group F (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
We offer a higher compensation depending on your expertise and skills.