MWP Process Engineer (d/m/f)

ams-OSRAM AG

Oberpremstätten

On-site

EUR 42,000 - 62,000

Full time

14 days+

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Job summary

ams-OSRAM AG in Austria seeks a technically skilled professional for single process ownership in mechanical wafer processing, covering backgrinding, bonding, sawing and debonding. You will apply SPC, FDC and support production goals, with ongoing process documentation and improvements.

Requirements include an HTL (Higher Technical College), strong German and English, and a proactive, independent work style within cross-functional teams.

Qualifications

  • HTL degree or equivalent
  • German and English proficiency
  • Ownership and proactive work style
  • Teamwork across functions
  • Excellent technical and analytical skills

Responsibilities

  • Single process ownership in mechanical wafer processing – backgrinding, bonding, sawing and debonding
  • Maintain single process performance with SPC and FDC
  • Support productivity goals of in-house production
  • Re‑qualification of single processes
  • Maintain related controlled documents (control plan; FMEA; Workstation Procedure; etc.)
  • Gain and further improve in-depth single process knowledge
  • Support single process development
  • Identify and drive single process improvements

Skills

German language
English language
Quality awareness (5S)
Ownership mindset

Education

HTL (Higher Technical College)

Job description

We are LSP – Light Sensors & Photonics, one of three business units within ams OSRAM, advancing the digitalization of light. At LSP, we go beyond traditional sensing—combining light, silicon, and system expertise to enable digital photonics solutions. Our focus is clear: powering next-generation applications in data centers, AR/VR, mobile and automotive, where light becomes a critical interface for data, perception, and interaction. This evolution marks a shift from components to integrated photonics systems —driving performance, scalability, and innovation in high-growth segments.


  • Single process ownership in the area of mechanical wafer processing – such as backgrinding, temporary/permanent bonding, sawing and debonding
  • Maintain single process performance by applying statistical process control (SPC), fault detection & classification (FDC), etc.
  • Support productivity goals of our in-house production
  • (re‑ qualification of single processes)
  • Maintain related controlled documents - e.g., control plan; Failure Mode and Effects Analysis (FMEA), Workstation Procedure (WSP); etc. & general documentation
  • Gain and further improve in-depth single process knowledge
  • Support of single process development
  • Identify and drive single process improvements

  • Finished education in a technical field, such as physics, chemistry, process technology, etc. (minimum requirement: “HTL (higher technical college)”; higher academical grades appreciated)
  • Understanding of basic quality requirements (5S, etc.)
  • Taking ownership, working pro-actively & independent
  • Working in technical and cross-functional teams
  • Excellent technical & analytical skills
  • Availability for weekend shifts
  • Very good communication skills in German and English

We offer competitive salaries and additional benefits based on your performance, experience and qualification.

The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group F (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).
We offer a higher compensation depending on your expertise and skills.

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