Advanced Packaging Process Specialist — Flexible Hours & Growth

BE Semiconductor Industries; Tirol; Remote; EUR 70,000 - 90,000; Full time

Job summary

BE Semiconductor Industries in Tyrol, Austria, seeks a highly skilled expert in advanced Die bonding to drive process improvements and development within a global organization. You will build deep process understanding and lead cross-functional teams in assembly technology.

Candidates should hold a Master’s or PhD in Microelectronics, Material Engineering, or Physics/Applied Physics, and demonstrate strong English communication skills.

Qualifications

• Master or PhD in Microelectronics, Material Engineering, or Physics/Applied Physics or related field.
• Experience in advanced Die bonding processes within a global organization is preferable.
• Advanced English language skills, written and spoken.

Responsibilities

• Build up deep process understanding of advanced packaging Die bonding processes.
• Drive continuous improvements on process capability, stability, yield and throughput.
• Develop and introduce new processes in assembly and connection technology with proper documentation.
• Plan and conduct DOEs to characterize process window and assess interactions.
• Collaborate with product specialists, customers and supply chain to select tooling.

Skills

English proficiency

Die bonding experience

Education

Master's or PhD in Microelectronics, Material Engineering, or Physics/Applied Physics

Job description

BE Semiconductor Industries in Tyrol, Austria, seeks a highly skilled expert in advanced Die bonding to drive process improvements and development within a global organization. You will build deep process understanding and lead cross-functional teams in assembly technology.

Candidates should hold a Master’s or PhD in Microelectronics, Material Engineering, or Physics/Applied Physics, and demonstrate strong English communication skills.