Wafer Process Engineer: Lead Precision Bonding & Sawing

ams-OSRAM AG; Unterpremstätten; Presencial; EUR 55 000 - 75 000; Tempo integral

Resumo da oferta

ams-OSRAM AG is seeking a technically skilled professional to own mechanical wafer processing, including backgrinding, bonding, sawing and debonding. You will apply SPC/FDC to maintain process performance and support productivity in in-house production.

Ideal candidates hold an HTL and show strong analytical abilities, ownership, and the ability to work in cross-functional teams. Weekend availability may be required.

Qualificações

• HTL or higher technical education completed.
• Knowledge of quality requirements (5S, etc.).
• Strong analytical and technical capabilities.

Responsabilidades

• Single process ownership in mechanical wafer processing (backgrinding, temporary/permanent bonding, sawing and debonding).
• Maintain single process performance by applying SPC and FDC techniques.
• Support productivity goals of our in-house production.
• (re-)qualification of single processes.
• Maintain related controlled documents (control plan; FMEA; Workstation Procedure).
• Gain and further improve in-depth single process knowledge.
• Support single process development and identify improvements.

Conhecimentos

5S basics

Ownership

Cross-functional teamwork

Technical & analytical skills

German and English communication

Formação académica

HTL (higher technical college)

Descrição da oferta de emprego

ams-OSRAM AG is seeking a technically skilled professional to own mechanical wafer processing, including backgrinding, bonding, sawing and debonding. You will apply SPC/FDC to maintain process performance and support productivity in in-house production.

Ideal candidates hold an HTL and show strong analytical abilities, ownership, and the ability to work in cross-functional teams. Weekend availability may be required.