Process Engineer - Mechanical Wafer Processing

ams-OSRAM AG; Oberpremstätten; On-site; EUR 42,000 - 62,000; Full time

Job summary

ams-OSRAM AG in Austria seeks a technically skilled professional for single process ownership in mechanical wafer processing, covering backgrinding, bonding, sawing and debonding. You will apply SPC, FDC and support production goals, with ongoing process documentation and improvements.

Requirements include an HTL (Higher Technical College), strong German and English, and a proactive, independent work style within cross-functional teams.

Qualifications

• HTL degree or equivalent
• German and English proficiency
• Ownership and proactive work style
• Teamwork across functions
• Excellent technical and analytical skills

Responsibilities

• Single process ownership in mechanical wafer processing – backgrinding, bonding, sawing and debonding
• Maintain single process performance with SPC and FDC
• Support productivity goals of in-house production
• Re‑qualification of single processes
• Maintain related controlled documents (control plan; FMEA; Workstation Procedure; etc.)
• Gain and further improve in-depth single process knowledge
• Support single process development
• Identify and drive single process improvements

Skills

German language

English language

Quality awareness (5S)

Ownership mindset

Education

HTL (Higher Technical College)

Job description

ams-OSRAM AG in Austria seeks a technically skilled professional for single process ownership in mechanical wafer processing, covering backgrinding, bonding, sawing and debonding. You will apply SPC, FDC and support production goals, with ongoing process documentation and improvements.

Requirements include an HTL (Higher Technical College), strong German and English, and a proactive, independent work style within cross-functional teams.