Process Specialist f/m/d

BE Semiconductor Industries; Tirol; Remote; EUR 70,000 - 90,000; Full time

Job summary

BE Semiconductor Industries in Tyrol, Austria, seeks a highly skilled expert in advanced Die bonding to drive process improvements and development within a global organization. You will build deep process understanding and lead cross-functional teams in assembly technology.

Candidates should hold a Master’s or PhD in Microelectronics, Material Engineering, or Physics/Applied Physics, and demonstrate strong English communication skills.

Qualifications

• Master or PhD in Microelectronics, Material Engineering, or Physics/Applied Physics or related field.
• Experience in advanced Die bonding processes within a global organization is preferable.
• Advanced English language skills, written and spoken.

Responsibilities

• Build up deep process understanding of advanced packaging Die bonding processes.
• Drive continuous improvements on process capability, stability, yield and throughput.
• Develop and introduce new processes in assembly and connection technology with proper documentation.
• Plan and conduct DOEs to characterize process window and assess interactions.
• Collaborate with product specialists, customers and supply chain to select tooling.

Skills

English proficiency

Die bonding experience

Education

Master's or PhD in Microelectronics, Material Engineering, or Physics/Applied Physics

Job description

We connect the real with the digital world

Besi is a leader in the research and development andproduction of high-end chip placement machines, with R&D, production and sales offices around the world. We support the semiconductor industry with know-how and equipment to advance 5G broadband technologies, autonomous driving, artificial intelligence (AI), high-performance computing and more.

Besi Austria was founded in 1986 and has been part of theDutch Besi Group since 2005. Our company, one of Besi´s R&Dfacilities is located in Radfeld, Tyrol, where we have employees from over 25 nations.

Your areas of impact

Build up deep process understanding of advanced packaging Die bonding processes with focus on Thermo Compression Bonding

Drive continuous improvements and optimization on existing processes on process capability, stability, yield and throughput

Drive development and introduction of new processes in the area of assembly and connection technology including documentation

Plan and conduct comprehensive DOEs to fundamentally characterize process window and understand process, equipment and materials interactions

Specifying and selection of tooling according to the process requirements in close cooperation with product specialists, costumer and supply chain

Collecting process know how from publications, conferences, books and standards as well as discussions with customers

Lead and participate in cross-functional and cross-organizational teams or work groups (product groups, process development team) to support process technology development

Your capacity for excellence

Master or PhD degree in Microelectronics or Material Engineering or Physics/Applied Physics or related field

Experience in the area of advanced Die bonding processes and in a global organization preferable

Advanced in English (written and oral)

Our commitment to nurturing your talents

We offer attractive and challenging work in a dynamic, team-oriented and highly innovative company. You will be working in a highly qualified team with an individually adjustable flexitime model and social benefits and numerous opportunities for professional and personal development.

Your salary will be based on your qualifications and experience and will be discussed with you personally. The minimum salary is based on the collective agreement for employees in the metal industry.