Senior Photonics Package Engineer

ams-OSRAM AG

Oberpremstätten

On-site

EUR 90,000 - 120,000

Full time

2 days ago

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Benefits offered by this job

Competitive salary

Performance-based pay

Travel opportunities

Job summary

ams-OSRAM AG in Austria’s Steiermark invites a senior packaging engineer to lead advanced semiconductor packaging projects for digital photonics and consumer electronics. You will design and optimize packages, perform mechanical/optical design and BOM management, and collaborate across IC design, QA, and manufacturing teams.

In this role you will drive development to completion within resource constraints, explore new materials and suppliers, and contribute to continuous tech improvements for

Qualifications

Advanced degree in a relevant technical field and extensive packaging experience.
Experience with high-volume semiconductor packaging and MEMS/CMOS knowledge is a plus.
Ability to model and draw components using SolidWorks or AutoCAD.

Responsibilities

Develop packages and package technologies for digital photonics and sensors.
Perform mechanical/optical design, BOMs, and simulations with partners.
Interface with IC design, QA, assembly, test, and product teams.
Drive on-time, on-budget package development to completion.
Identify cost-improvement opportunities for high-volume production.

Skills

Strong communication

Analytical thinking

Problem solving

Fluent in English

Travel willingness

Education

Advanced degree in Physics/ Chemistry/ Materials Science/ Optics/ Engineering

10+ years semiconductor packaging experience

Tools

SolidWorks

AutoCAD

Job description

In this role you will drive development to completion within resource constraints, explore new materials and suppliers, and contribute to continuous tech improvements for

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