Senior Staff Engineer, Chip-Package Co-Design & Simulation

Infineon Technologies AG; Villach; On-site; EUR 90,000 - 120,000; Full time

Job summary

Infineon Technologies AG in Austria invites an experienced Staff Engineer to shape next‑gen CPB co‑design methodologies and simulation‑driven packaging. You will develop and support CPB co‑design flows, enable multi‑physics simulations, and drive tool environments in Linux‑based HPC settings.

You will collaborate with business lines and design teams worldwide, own the simulation environment, mentor engineers, and push automation and ML/AI integration for increasingly complex packaging

Qualifications

• Must have a degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering or Mechanical Engineering.
• At least 4 years of professional experience in semiconductor package development, simulation, or related engineering fields.
• Strong background in electromagnetic, thermal or multiphysics simulation for semiconductor package and system development.

Responsibilities

• Develop and support simulation methodologies, design flows, and tool environments for CPB Co-Design and advanced package development in Linux-based HPC environment.
• Drive and continuously improve methodologies for electromagnetic, thermal and multiphysics analysis supporting semiconductor package and system development.
• Own and maintain the simulation environment within the CPB Co-Design Flow & Methodology team and provide consulting and support to product development projects worldwide.
• Enable simulation-driven design and verification for advanced packaging technologies including System-in-Package (SiP), heterogeneous integration, and 2.5D/3D package solutions.
• Collaborate closely with Business Lines, Design Systems, package development teams, and external technology partners to address simulation requirements and develop best-in-class engineering solutions.
• Drive technology evaluations, benchmarks, automation initiatives, and knowledge sharing activities to continuously improve simulation capabilities and engineering productivity.

Skills

Electromagnetic simulation

Thermal simulation

Multiphysics simulation

Linux

Python

MATLAB

Bash

Perl

Education

Degree in Electrical Engineering, Microelectronics, Physics, Computational Engineering, Mechanical Engineering

Tools

Synopsys/Ansys

Cadence

Siemens

Keysight

COMSOL

Job description

Infineon Technologies AG in Austria invites an experienced Staff Engineer to shape next‑gen CPB co‑design methodologies and simulation‑driven packaging. You will develop and support CPB co‑design flows, enable multi‑physics simulations, and drive tool environments in Linux‑based HPC settings.

You will collaborate with business lines and design teams worldwide, own the simulation environment, mentor engineers, and push automation and ML/AI integration for increasingly complex packaging