Wet Process Applications Engineer, On-Site Hillsboro

Pasona N A, Inc.

Hillsboro (OR)

On-site

USD 90,000 - 120,000

Full time

29 hours ago
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Job summary

Pasona N A, Inc. is seeking a Wet Process and Applications Engineer to support development, integration, and sales of advanced semiconductor manufacturing equipment in Hillsboro, Oregon.

The role requires strong technical leadership and cross-functional collaboration with customer R&D teams and partners. The successful candidate will lead onsite engagements, contribute to process development for cleaning and wet etching, and coordinate with a Japan-based factory development team, with travel

Qualifications

  • 3+ years of relevant experience in wet process engineering in a R&D role at a device manufacturer or semiconductor equipment manufacturer.
  • Understanding of wet cleaning and etching processes, process integration, and applications.
  • Familiarity with single wafer tools is desirable but not essential.

Responsibilities

  • Work in a laboratory setting to identify potential solutions for customer processing challenges.
  • Lead onsite development engagements between the company and customer R&D engineering teams.
  • Collaborate with partners and the service engineering team to document and propose future hardware and process requirements for the factory development team in Japan.
  • Develop new and improved cleaning and wet etching applications for advanced semiconductor applications on single wafer and batch tools.
  • Prepare clear status reports for technical and executive management teams and customers.
  • Identify product solutions to solve customer needs and communicate with customer engineering and sales teams.

Skills

Wet process engineering
Project management
Cross-functional collaboration

Education

MS/PhD in Chemical Engineering, Chemistry, Materials Science or Physics

Tools

Single wafer tools

Job description

Pasona N A, Inc. is seeking a Wet Process and Applications Engineer to support development, integration, and sales of advanced semiconductor manufacturing equipment in Hillsboro, Oregon.

The role requires strong technical leadership and cross-functional collaboration with customer R&D teams and partners. The successful candidate will lead onsite engagements, contribute to process development for cleaning and wet etching, and coordinate with a Japan-based factory development team, with travel

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