Wafer Bonding R&D Intern – AI-Driven Process Innovation

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 28,000 - 41,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Retirement benefits

Job summary

Micron Technology, Inc. is seeking a Wafer Bonding Process Development Intern in Boise, Idaho. You will work with experienced engineers to research, develop, and optimize wafer bonding technologies for next-generation semiconductor devices.

You will design and run experiments, analyze data, and communicate findings through technical reports and presentations while leveraging AI tools to boost productivity and learning in a fast-paced R&D environment.

Qualifications

• Pursuing MS or PhD in a technical field related to semiconductor processing.
• Understanding wafer bonding principles and semiconductor processing applications.
• Research, laboratory, internship, or project experience in a semiconductor-related field.
• Working knowledge of statistics, mathematical analysis, and experimental design methodologies.
• Strong written, verbal, and presentation skills with the ability to communicate technical concepts effectively.

Responsibilities

• Support the research and development of manufacturable wafer bonding technologies for next-generation semiconductor devices.
• Plan, execute, and analyze experiments; communicate findings through clear technical reports and presentations.
• Identify and implement process improvements to enhance yield, quality, cycle time, and manufacturing readiness.
• Evaluate new wafer bonding equipment, materials, and process solutions through structured characterization and data analysis.
• Leverage approved Artificial Intelligence (AI) and AI-Enabled tools to improve productivity, accelerate learning, and support process development activities.

Skills

Statistics

Experimental design

Communication skills

Presentation skills

Education

MS or PhD in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering, or related technical field

Job description

Micron Technology, Inc. is seeking a Wafer Bonding Process Development Intern in Boise, Idaho. You will work with experienced engineers to research, develop, and optimize wafer bonding technologies for next-generation semiconductor devices.

You will design and run experiments, analyze data, and communicate findings through technical reports and presentations while leveraging AI tools to boost productivity and learning in a fast-paced R&D environment.