Principal Wafer Bonding Process Engineer - AI-Driven Yield

Micron Technology; Boise (ID); On-site; USD 140,000 - 190,000; Full time

Benefits offered by this job

Health programs

Savings programs

Stock purchase discount

Time off program

Job summary

Micron Technology is seeking a Staff/Principal Wafer Bonding Process Engineer in Boise, Idaho to advance next-generation DRAM bonding. You will lead development, plan experiments, and collaborate with cross-functional teams to improve yield, cost, and reliability while applying AI/ML tools to complex problems.

You will contribute to process technology from development to manufacturing, tackling line challenges and qualifying new equipment and materials for high-volume production.

Qualifications

• PhD with 3+ years, MS with 5+ years, or BS with 7+ years in semiconductor industry.
• 5+ years developing and driving wafer bonding technologies or related processes.
• Hands-on experience with direct bonding, hybrid bonding, wafer thinning, or de-bonding.
• Strong analytical and problem-solving skills with data-driven decision making.
• Ability to lead projects across cross-functional teams and deliver results.
• Experience improving quality, reliability, yield, cost, and manufacturing readiness.

Responsibilities

• Develop and optimize wafer bonding processes for next-generation DRAM.
• Plan and execute DOEs to improve process performance and reliability.
• Drive yield improvement, cost reduction, and productivity using data-driven methods.
• Evaluate and qualify new equipment, materials, and process technologies.
• Collaborate with manufacturing and suppliers to implement improvements.
• Apply AI/ML/LLM tools to boost efficiency and problem solving.

Skills

Analytical skills

Problem-solving

Cross-functional collaboration

Data-driven decisions

Education

PhD

Master's degree

Bachelor's degree

Tools

Direct bonding

Hybrid bonding

Wafer thinning

De-bonding

Job description

Micron Technology is seeking a Staff/Principal Wafer Bonding Process Engineer in Boise, Idaho to advance next-generation DRAM bonding. You will lead development, plan experiments, and collaborate with cross-functional teams to improve yield, cost, and reliability while applying AI/ML tools to complex problems.

You will contribute to process technology from development to manufacturing, tackling line challenges and qualifying new equipment and materials for high-volume production.