Wafer Bonding Process Development Intern — AI-Driven R&D

Micron; Boise (ID); On-site; USD 28,000 - 41,000; Full time

Benefits offered by this job

Medical/dental/vision plans

Paid time off

Paid holidays

Paid family leave

Job summary

Micron Technology, based in Boise, Idaho, is seeking a Wafer Bonding Process Development Intern to join the R&D team. You will design and run experiments, analyze data, and help optimize wafer bonding for next‑generation semiconductor devices.

You will collaborate with experienced engineers, apply AI tools to speed up learning, improve yield and manufacturability, and communicate findings through technical reports and presentations.

Qualifications

• Currently pursuing an MS or PhD in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering, or a related technical field.
• Demonstrated understanding of wafer bonding principles and semiconductor processing applications.
• Research, laboratory, internship, or project experience in a semiconductor-related field.
• Working knowledge of statistics, mathematical analysis, and experimental design methodologies.
• Strong written, verbal, and presentation skills with the ability to communicate technical concepts effectively.

Responsibilities

• Support research and development of manufacturable wafer bonding technologies for next-generation semiconductor devices.
• Plan, execute, and analyze experiments; communicate findings through clear technical reports and presentations.
• Identify and implement process improvements to enhance yield, quality, cycle time, and manufacturing readiness.
• Evaluate new wafer bonding equipment, materials, and process solutions through structured characterization and data analysis.
• Leverage approved Artificial Intelligence (AI) and AI-Enabled tools to improve productivity, accelerate learning, and support process development activities.

Skills

Wafer bonding principles

Semiconductor processing

Statistics & experimental design

Communication skills

Education

MS or PhD in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering (or related field)

Tools

AI tools

Job description

Micron Technology, based in Boise, Idaho, is seeking a Wafer Bonding Process Development Intern to join the R&D team. You will design and run experiments, analyze data, and help optimize wafer bonding for next‑generation semiconductor devices.

You will collaborate with experienced engineers, apply AI tools to speed up learning, improve yield and manufacturability, and communicate findings through technical reports and presentations.