Wafer Bonding Process R&D Intern - Build Next-Gen Semiconductors

Micron Technology, Inc; Boise (ID); Hybrid; USD 20,000 - 27,000; Part time

Job summary

Micron Technology, Inc. in Boise, Idaho invites a Wafer Bonding Process Development Intern to contribute to cutting-edge semiconductor research. You will work with engineers to design experiments, analyze results, and implement improvements in wafer bonding processes.

The role emphasizes AI-enabled workflows, data visualization, and collaboration across disciplines in a fast-paced R&D setting. This internship offers hands-on experience with state-of-the-art technology and practical training.

Qualifications

• Pursuing MS or PhD in a technical field.
• Experience with wafer bonding principles or semiconductor processing beneficial.
• Strong communication and data interpretation skills.

Responsibilities

• Support R&D of manufacturable wafer bonding technologies.
• Plan and analyze experiments; communicate findings clearly.
• Identify process improvements to enhance yield and readiness.
• Evaluate new equipment and materials with data analysis.
• Utilize approved AI tools to speed up development.

Skills

Statistical analysis

Experiment design

Presentation skills

Communication

Education

MS or PhD in Chemical Eng/Chm/Mats Sci/Electrical Eng

Tools

AI tools

Job description

Micron Technology, Inc. in Boise, Idaho invites a Wafer Bonding Process Development Intern to contribute to cutting-edge semiconductor research. You will work with engineers to design experiments, analyze results, and implement improvements in wafer bonding processes.

The role emphasizes AI-enabled workflows, data visualization, and collaboration across disciplines in a fast-paced R&D setting. This internship offers hands-on experience with state-of-the-art technology and practical training.