Wafer Bonding Process Development Intern — AI-Driven R&D

Micron Technology

Boise (ID)

On-site

USD 28,000 - 41,000

Full time

5 days ago
Be an early applicant

Get more replies from employers

Send a job-specific resume in minutes.

Benefits offered by this job

Medical/dental/vision
Paid time off
Paid holidays
Benefits guide access

Job summary

Micron Technology in Boise, Idaho is offering a Wafer Bonding Process Development Intern role within the Technology Development (R&D) organization. You will design and execute experiments, evaluate process solutions, and analyze data to improve yield, quality, and manufacturability in next-generation semiconductor devices.

You will work with AI-enabled tools, collaborate with engineers, and communicate findings through technical reports and presentations while pursuing an MS or PhD in a related

Qualifications

  • Pursuing MS or PhD in a technical field.
  • Strong data analysis, statistics, and experimental design skills.
  • Excellent written, verbal, and presentation abilities.
  • Experience in semiconductor processing or wafer bonding is a plus.
  • Ability to work both independently and in a team.

Responsibilities

  • Support the research and development of manufacturable wafer bonding technologies for next-generation semiconductor devices.
  • Plan, execute, and analyze experiments; communicate findings through clear technical reports and presentations.
  • Identify and implement process improvements to enhance yield, quality, cycle time, and manufacturing readiness.
  • Evaluate new wafer bonding equipment, materials, and process solutions through structured characterization and data analysis.
  • Leverage approved AI and AI-enabled tools to improve productivity and support process development activities.

Job description

Micron Technology in Boise, Idaho is offering a Wafer Bonding Process Development Intern role within the Technology Development (R&D) organization. You will design and execute experiments, evaluate process solutions, and analyze data to improve yield, quality, and manufacturability in next-generation semiconductor devices.

You will work with AI-enabled tools, collaborate with engineers, and communicate findings through technical reports and presentations while pursuing an MS or PhD in a related

Get your free, confidential resume review.
or drag and drop your file here.
Similar jobs

Similar jobs worth comparing

Wafer Bonding R&D Intern – AI-Driven Process Innovation
Wafer Bonding R&D Intern – AI-Driven Process Innovation

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 28,000 - 41,000
Medical, dental and vision plans
Paid time off
Paid holidays
+1
Wafer Bonding Process R&D Intern - Build Next-Gen Semiconductors
Wafer Bonding Process R&D Intern - Build Next-Gen Semiconductors

Micron Technology, Inc • Boise (ID)

Hybrid
USD 20,000 - 27,000
Wafer Bonding Process Development Intern — AI Tools
Wafer Bonding Process Development Intern — AI Tools

Micron Technology, Inc • Boise (ID)

On-site
USD 90,000 - 120,000
Medical plans
Dental plans
Vision plans
+3
Intern - Wafer Bonding Process Development
Intern - Wafer Bonding Process Development

Micron Technology • Boise (ID)

On-site
USD 28,000 - 41,000
Medical/dental/vision
Paid time off
Paid holidays
+1
Senior Wafer Bonding Process Engineer - AI-Driven
Senior Wafer Bonding Process Engineer - AI-Driven

Micron Technology, Inc • Boise (ID)

On-site
USD 120,000 - 180,000
Principal Wafer Bonding Process Engineer - AI-Driven Yield
Principal Wafer Bonding Process Engineer - AI-Driven Yield

Micron Technology • Boise (ID)

On-site
USD 140,000 - 190,000
Health programs
Savings programs
Stock purchase discount
+1
Intern - Wafer Bonding Process Development
Intern - Wafer Bonding Process Development

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 28,000 - 41,000
Medical, dental and vision plans
Paid time off
Paid holidays
+1
Senior Wafer Bonding Process Engineer
Senior Wafer Bonding Process Engineer

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 120,000 - 210,000
Health benefits
Savings plans
Wellbeing programs
+2
Intern - Wafer Bonding Process Development Boise, Idaho, United States of America Posted a day ago
Intern - Wafer Bonding Process Development Boise, Idaho, United States of America Posted a day ago

Micron Technology, Inc • Boise (ID)

Hybrid
USD 20,000 - 27,000
Wafer Bonding Process Engineer: Advanced Development
Wafer Bonding Process Engineer: Advanced Development

Micron Technology, Inc • Boise (ID)

On-site
USD 75,000 - 95,000
Medical, dental and vision plans
Paid family leave
Paid time-off program
+1