Wafer Bonding Process Development Intern — AI Tools

Micron Technology, Inc; Boise (ID); On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Retirement plan

Job summary

Micron Technology, Inc. is seeking a candidate for the Wafer Bonding team in Boise to advance wafer bonding technologies for next-generation devices. You will plan and run experiments, analyze data, document results, and communicate findings with the team.

The role emphasizes applying statistical methods and data visualization, with opportunities to use AI tools to boost productivity and process development. Collaboration across engineering disciplines is expected.

Qualifications

• Pursuing MS or PhD in a related technical field with a focus on wafer bonding or semiconductor processes.
• Understanding of wafer bonding principles and semiconductor processing applications.
• Experience with laboratory, internship, or project work in a semiconductor context.
• Strong written, verbal, and presentation skills for technical communication.

Responsibilities

• Support research and development of manufacturable wafer bonding technologies for next-generation semiconductor devices.
• Plan, execute, and analyze experiments; communicate findings through clear technical reports and presentations.
• Identify and implement process improvements to enhance yield, quality, cycle time, and manufacturing readiness.
• Evaluate new wafer bonding equipment, materials, and process solutions through structured characterization and data analysis.
• Leverage approved AI and AI-enabled tools to improve productivity, accelerate learning, and support process development activities.

Skills

Statistical data analysis

Data visualization

Machine learning basics

Semiconductor processing knowledge

Research communication

Education

MS or PhD in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering, or related field

Job description

Micron Technology, Inc. is seeking a candidate for the Wafer Bonding team in Boise to advance wafer bonding technologies for next-generation devices. You will plan and run experiments, analyze data, document results, and communicate findings with the team.

The role emphasizes applying statistical methods and data visualization, with opportunities to use AI tools to boost productivity and process development. Collaboration across engineering disciplines is expected.