Intern - Wafer Bonding Process Development

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 28,000 - 41,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time off

Paid holidays

Retirement benefits

Job summary

Micron Technology, Inc. is seeking a Wafer Bonding Process Development Intern in Boise, Idaho. You will work with experienced engineers to research, develop, and optimize wafer bonding technologies for next-generation semiconductor devices.

You will design and run experiments, analyze data, and communicate findings through technical reports and presentations while leveraging AI tools to boost productivity and learning in a fast-paced R&D environment.

Qualifications

• Pursuing MS or PhD in a technical field related to semiconductor processing.
• Understanding wafer bonding principles and semiconductor processing applications.
• Research, laboratory, internship, or project experience in a semiconductor-related field.
• Working knowledge of statistics, mathematical analysis, and experimental design methodologies.
• Strong written, verbal, and presentation skills with the ability to communicate technical concepts effectively.

Responsibilities

• Support the research and development of manufacturable wafer bonding technologies for next-generation semiconductor devices.
• Plan, execute, and analyze experiments; communicate findings through clear technical reports and presentations.
• Identify and implement process improvements to enhance yield, quality, cycle time, and manufacturing readiness.
• Evaluate new wafer bonding equipment, materials, and process solutions through structured characterization and data analysis.
• Leverage approved Artificial Intelligence (AI) and AI-Enabled tools to improve productivity, accelerate learning, and support process development activities.

Skills

Statistics

Experimental design

Communication skills

Presentation skills

Education

MS or PhD in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering, or related technical field

Job description

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, our vision is to transform how the world uses information to enrich life for all. The Technology Development (R&D) organization is responsible for developing innovative memory and storage technologies that enable next-generation semiconductor products. The Wafer Bonding team focuses on advancing wafer bonding processes and equipment, driving technology acceleration, manufacturability, and performance improvements through research, experimentation, and collaboration across engineering fields. As a Wafer Bonding Process Development Intern based in Boise, Idaho, you will contribute to the research, development, and optimization of advanced wafer bonding technologies that support future semiconductor products. Working alongside experienced engineers and researchers, you will design and execute experiments, evaluate new process solutions and equipment, and analyze data to improve process performance, yield, quality, and manufacturability. This internship offers a chance to apply scientific and engineering principles in a modern R&D environment. It involves using Artificial Intelligence (AI) tools and advanced analytics to speed up learning, process development, and innovation.

Responsibilities

• Support the research and development of manufacturable wafer bonding technologies for next-generation semiconductor devices.
• Plan, execute, and analyze experiments; communicate findings through clear technical reports and presentations.
• Identify and implement process improvements to enhance yield, quality, cycle time, and manufacturing readiness.
• Evaluate new wafer bonding equipment, materials, and process solutions through structured characterization and data analysis.
• Leverage approved Artificial Intelligence (AI) and AI-Enabled tools to improve productivity, accelerate learning, and support process development activities.

Minimum Qualifications

• Currently pursuing an MS or PhD in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering, or a related technical field.
• Demonstrated understanding of wafer bonding principles and semiconductor processing applications.
• Research, laboratory, internship, or project experience in a semiconductor-related field.
• Working knowledge of statistics, mathematical analysis, and experimental design methodologies.
• Strong written, verbal, and presentation skills with the ability to communicate technical concepts effectively.

Preferred Qualifications

• Experience analyzing semiconductor process data using statistical methods and data visualization techniques.
• Knowledge of machine learning algorithms and their application to engineering or process development problems.
• Experience applying Artificial Intelligence (AI) tools or AI-Assisted workflows to enhance technical research, data analysis, or productivity.
• Proven ability to work independently and collaboratively in a dynamic, fast-paced research environment.
• Strong problem-solving skills with attention to detail and a focus on achieving outcomes.

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here. To learn more about Micron, please visit micron.com/careers For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [e-mail] or 1-800-336-8918 (select option #3) Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards. Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron. AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification. Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.