Thermal Engineer

Acceler8; Massachusetts; On-site; USD 150,000 - 220,000; Full time

Benefits offered by this job

Founding equity

Job summary

Acceler8 Talent is seeking a Thermo-Mechanical Engineer for an onsite role in Boston, MA. The startup seeks a founder-level contributor to own thermal and mechanical design, driving first-principles solutions for next-generation 3D heterogeneous integration.

You will lead simulation, validation, and reliability programs for packaging, microbump fatigue, and die-attach considerations, shaping the platform from day one with an equity option among the founding team.

Qualifications

• PhD with 2+ years or MS with 5+ years of relevant experience, or equivalent practical experience.
• Strong experience with thermal and structural FEA using ANSYS, COMSOL, Icepak or similar tools.
• Experience with advanced semiconductor packaging, heterogeneous integration or 3D stacked die.
• Strong understanding of thermal management, mechanical stress, warpage and reliability.
• Hands-on experience with thermal measurement, validation or advanced cooling technologies.
• Experience with package-level simulations, microbump fatigue or die-attach reliability is a strong plus.

Responsibilities

• Lead thermal and mechanical design from day one for a founding team project.
• Develop simulation and reliability methodologies to underpin the platform.
• Own complex engineering challenges from first principles.
• Collaborate across disciplines to ensure robust thermal management and packaging success.

Skills

First principles thinking

Cross-functional collab

Education

PhD +2 yrs or MS +5 yrs

Tools

ANSYS

COMSOL

Icepak

Job description

Thermo-Mechanical Engineer – Boston, MA (Onsite)

I'm currently hiring for an early-stage semiconductor startup developing next-generation 3D heterogeneous integration technology. They're building advanced semiconductor systems that combine silicon, III-V materials and novel interposers into a single package, targeting applications across defense, aerospace, power electronics and future AI compute infrastructure.

They're looking for an experienced Thermo-Mechanical Engineer who enjoys taking ownership of complex engineering challenges from first principles. This is a rare opportunity to join as a founding engineer, lead thermal and mechanical design from day one, and develop the simulation and reliability methodologies that will underpin an entirely new semiconductor integration platform.

What they're looking for:

• PhD with 2+ years or MS with 5+ years of relevant experience, or equivalent practical experience
• Strong experience with thermal and structural FEA using ANSYS, COMSOL, Icepak or similar tools
• Experience with advanced semiconductor packaging, heterogeneous integration or 3D stacked die
• Strong understanding of thermal management, mechanical stress, warpage and reliability
• Hands-on experience with thermal measurement, validation or advanced cooling technologies
• Experience with package-level simulations, microbump fatigue or die-attach reliability is a strong plus

Important details:

• Fully onsite in Boston, MA
• $150K–$220K base + founding-team equity