Thermo-Mechanical Engineer

Acceler8 Talent; Massachusetts; On-site; USD 120,000 - 170,000; Full time

Job summary

Acceler8 Talent is seeking a Thermal & Thermo-Mechanical Engineer for an early-stage semiconductor company developing a multi-material 3D integration platform. You design, simulate and validate thermal and mechanical performance in dense packages to enable higher density and reliability.

You will translate models into design choices, work with packaging, electrical and reliability engineers, and drive hardware validation from concept to working hardware in a small, fast-moving team.

Qualifications

• Deep ownership of thermal or thermo-mechanical engineering in constrained hardware (semiconductor packaging, etc).
• Hands-on FEA or multiphysics experience with real hardware impact.
• Experience moving from simulation to physical testing and iteration.
• Ability to explain modelling assumptions, boundary conditions and validation methods.
• Understanding of how materials, interfaces and package construction affect thermal/mechanical behaviour.
• Ability to work across materials, mechanical, packaging and electrical disciplines.
• Willingness to take broad technical ownership in a small, evolving team.

Responsibilities

• Model thermal and thermo-mechanical behaviour in high-density semiconductor packages and 3D systems.
• Translate simulation results into decisions about package architecture, materials, interfaces and cooling.
• Collaborate with electrical, packaging and reliability engineers to resolve coupled system trade-offs.
• Carry analysis through implementation, testing and design iteration.
• Validate predictions against measured hardware, investigate discrepancies and feed findings into the next design.
• Help establish thermal-design and validation practices within a founding-stage semiconductor team.

Skills

Thermal engineering

Thermo-mechanical

FEM / Multiphysics

Physical testing

System integration

Cross-functional collaboration

Small-team ownership

Tools

ANSYS / COMSOL

Job description

We're working with an early-stage semiconductor company developing a multi-material 3D integration platform. The approach combines materials such as GaN, silicon, glass and diamond to address circuit, packaging and thermal requirements together.

The initial focus is RF systems for radar and low-Earth-orbit communications, with a longer-term platform spanning power electronics, compute and photonics.

They're hiring a Thermal & Thermo-Mechanical Engineer to shape how these dense, vertically integrated systems are designed. Thermal performance is a foundational architecture constraint, with simulation, materials, packaging and hardware validation informing decisions from the outset.

The role

• Model thermal and thermo-mechanical behaviour in high-density semiconductor packages and 3D systems.
• Translate simulation results into decisions about package architecture, materials, interfaces and cooling.
• Work with electrical, packaging and reliability engineers to resolve coupled system trade-offs.
• Carry analysis through implementation, testing and design iteration.
• Validate predictions against measured hardware, investigate discrepancies and feed findings into the next design.
• Help establish thermal-design and validation practices within a founding-stage semiconductor team.

Your experience

• Deep ownership of thermal or thermo-mechanical engineering in semiconductor packaging, power electronics or other constrained hardware.
• Strong hands-on FEA or multiphysics experience, with clear examples of analysis that changed real hardware decisions.
• Experience taking work beyond simulation into implementation, physical testing and iteration.
• The ability to explain modelling assumptions, boundary conditions and how you validated your conclusions.
• An understanding of how material choices, interfaces and package construction affect thermal and mechanical behaviour.
• The ability to work across materials, mechanical, packaging and electrical disciplines.
• Comfort with broad technical responsibility and hands-on execution in a small team with evolving requirements.

You’ll influence the architecture of a semiconductor platform where thermal performance directly shapes what can be built. Your work will connect material and package choices with electrical requirements and measured system behaviour.

The role offers broad ownership, direct collaboration with the founding team and the opportunity to carry analysis through to working hardware.

This is an opportunity for someone who wants to make thermal engineering central to product development and take responsibility for how designs perform in practice.