Thermal Solutions Architect - Data Center Cooling Leader

Vertiv Group Corporation; Westerville (OH); On-site; USD 120,000 - 170,000; Full time

Benefits offered by this job

Uncapped monthly commission

Sales Incentive Plan

Job summary

Vertiv is seeking a proactive Senior Solutions Architect - Thermal Management to lead the technical positioning, specification, and market adoption of our cooling solutions for data centers. You will partner with consulting engineers, hyperscale clients, and national sales teams from our Columbus, OH headquarters on site.

With 3–6+ years in technical sales or engineering and deep domain mastery of high-density cooling and direct-to-chip architectures, you will shape product roadmaps and

Qualifications

• 3–6+ years in technical sales, application or consulting engineering for data center infra or HVAC systems.
• Deep knowledge of data center thermal management and high-density cooling.
• Experience navigating consulting engineering workflows and design cycles.
• Ability to translate complex concepts into executive-ready presentations.

Responsibilities

• Solution Architecture & Specification: design high-density cooling systems and establish Basis of Design with engineers.
• Commercial & Account Enablement: co-lead technical pitches, bid strategies, and Lunch & Learns with sales teams.
• Market & Product Leadership: represent Vertiv at trade shows and design reviews to guide roadmaps.

Skills

Technical sales

Data center cooling

Direct-to-chip architectures

High-density cooling

Communication & presentation

Education

Bachelor's degree in Mechanical or Electrical Engineering

Job description

Vertiv is seeking a proactive Senior Solutions Architect - Thermal Management to lead the technical positioning, specification, and market adoption of our cooling solutions for data centers. You will partner with consulting engineers, hyperscale clients, and national sales teams from our Columbus, OH headquarters on site.

With 3–6+ years in technical sales or engineering and deep domain mastery of high-density cooling and direct-to-chip architectures, you will shape product roadmaps and