Thermal Modeling Architect for Advanced Package Tech

AMD; Austin (TX); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

AMD benefits

Job summary

AMD in Austin, Texas seeks an Advanced Package Thermal Technologist to lead model-based architecture and thermal design for next-generation packaging platforms. You will develop and validate thermal models guiding SoC/package/board-level decisions and support STCO initiatives.

You will collaborate across silicon, package, board, and system teams, own modeling rigor and experimental grounding, influence product roadmaps for data center and HPC systems, and mentor teams on multi-physics with CFD

Qualifications

• Demonstrated experience owning and driving model-based architecture and design decisions.
• Solid foundation in thermal and CFD first-principles understanding.
• Strong background in advanced PCB technologies, including materials, designs, and assembly constraints.
• Experience integrating electro-thermal and electro-optical technologies at the board and package level.
• Experience influencing SMT processes, connectors, and assembly strategies from an architecture and modeling perspective.
• Proven industry or research experience with modeling-driven system or platform architecture roles.
• Track record of influencing experimental test plans and correlating simulation with physical test data.
• Familiarity with AI/ML-based engineering workflows.

Responsibilities

• Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
• Develop and maintain thermal and multi-physics models and drive validation strategies for STCO across silicon, package, board and platform.
• Engage with suppliers and vendors to align material properties and modeling assumptions with architecture needs.
• Define targets and strategic direction for thermal and package technology development and influence product roadmaps.
• Serve as a thermal subject-matter expert for SoC, package and system-level architectures with a focus on data center platforms.

Skills

Model-based design

Thermal modeling

System-level modeling

PCB technologies

Electro-thermal

SMT processes

Lab collaboration

AI/ML workflows

Education

MS or PhD in Engineering or Physics

Job description

AMD in Austin, Texas seeks an Advanced Package Thermal Technologist to lead model-based architecture and thermal design for next-generation packaging platforms. You will develop and validate thermal models guiding SoC/package/board-level decisions and support STCO initiatives.

You will collaborate across silicon, package, board, and system teams, own modeling rigor and experimental grounding, influence product roadmaps for data center and HPC systems, and mentor teams on multi-physics with CFD