Advanced Package Thermal Technologist

AMD; Austin (TX); On-site; USD 180,000 - 240,000; Full time

Benefits offered by this job

AMD benefits

Job summary

AMD in Austin, Texas seeks an Advanced Package Thermal Technologist to lead model-based architecture and thermal design for next-generation packaging platforms. You will develop and validate thermal models guiding SoC/package/board-level decisions and support STCO initiatives.

You will collaborate across silicon, package, board, and system teams, own modeling rigor and experimental grounding, influence product roadmaps for data center and HPC systems, and mentor teams on multi-physics with CFD

Qualifications

• Demonstrated experience owning and driving model-based architecture and design decisions.
• Solid foundation in thermal and CFD first-principles understanding.
• Strong background in advanced PCB technologies, including materials, designs, and assembly constraints.
• Experience integrating electro-thermal and electro-optical technologies at the board and package level.
• Experience influencing SMT processes, connectors, and assembly strategies from an architecture and modeling perspective.
• Proven industry or research experience with modeling-driven system or platform architecture roles.
• Track record of influencing experimental test plans and correlating simulation with physical test data.
• Familiarity with AI/ML-based engineering workflows.

Responsibilities

• Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
• Develop and maintain thermal and multi-physics models and drive validation strategies for STCO across silicon, package, board and platform.
• Engage with suppliers and vendors to align material properties and modeling assumptions with architecture needs.
• Define targets and strategic direction for thermal and package technology development and influence product roadmaps.
• Serve as a thermal subject-matter expert for SoC, package and system-level architectures with a focus on data center platforms.

Skills

Model-based design

Thermal modeling

System-level modeling

PCB technologies

Electro-thermal

SMT processes

Lab collaboration

AI/ML workflows

Education

MS or PhD in Engineering or Physics

Job description

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future. Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.

Advanced Package Thermal Technologist

The Role

In this role, you will serve as a Package-centric Thermal Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO). You will develop, validate, and apply thermal models to guide SoC/package/board-level architecture, technology selection and integration of electro-thermal and electro-optical capabilities across package, board, and cooling solutions.

The Person

The ideal candidate is a self-directed technical leader who operates with a high degree of autonomy, communicates with clarity, and collaborates effectively across silicon, package, board, thermal, optical, mechanical, manufacturing, and system architecture teams. You are comfortable owning both the modeling rigor and experimental grounding required for package-driven architecture & design decisions and influence product and platform roadmaps for data center and high-performance computing systems.

Key Responsibilities

• Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
• Develop and maintain thermal and multi-physics models (thermal, thermo-mechanical, electro-thermal and electro-optical) & drive validation strategies partnering with internal and external labs as required to enable STCO across silicon, package, board and platform.
• Engage with suppliers, partners, and component vendors to align material properties, process capabilities, and modeling assumptions with architecture and STCO needs.
• Define targets and strategic direction for thermal and package technology development, assess technology readiness, and influence product roadmaps.
• Serve as a thermal subject-matter expert for SoC, package and system-level architectures with a primary focus on data center platforms.

Preferred Experience

• Demonstrated experience owning and driving model-based architecture & design decisions, supported by SoC, package, and system-level thermal modeling, characterization and validation.
• Solid foundation in Thermal and CFD first-principles understanding and multi-physics SoC-package-system-level design & assembly trade-offs.
• Strong background in advanced PCB technologies, including materials, designs, and assembly constraints.
• Experience integrating electro-thermal and electro-optical technologies at the board and package level, informed by modeling and experimental correlation.
• Experience influencing SMT processes, connectors, and assembly strategies from an architecture and modeling perspective.
• Proven relevant industry or research experience with increasing responsibility in modeling-driven system or platform architecture roles.
• Track record of influencing experimental test plans and correlating simulation with physical test data (e.g., DOE design, instrumentation selection, or lab collaboration for model validation).
• Familiarity with AI/ML-based engineering workflows, such as surrogate/reduced-order modeling, automated optimization pipelines, or ML-assisted anomaly/failure detection applied to physics-based data.

Academic Credentials

MS or PhD in relevant Engineering disciplines or physics.

LOCATION

Austin, Texas

This role is not eligible for visa sponsorship

Benefits offered are described: AMD benefits at a glance.

AMD does not accept unsolicited resumes from headhunters, recruitment agencies, or fee-based recruitment services. AMD and its subsidiaries are equal opportunity, inclusive employers and will consider all applicants without regard to age, ancestry, color, marital status, medical condition, mental or physical disability, national origin, race, religion, political and/or third-party affiliation, sex, pregnancy, sexual orientation, gender identity, military or veteran status, or any other characteristic protected by law. We encourage applications from all qualified candidates and will accommodate applicants’ needs under the respective laws throughout all stages of the recruitment and selection process.

AMD may use Artificial Intelligence to help screen, assess or select applicants for this position. AMD’s “Responsible AI Policy” is available here.

This posting is for an existing vacancy.