Packaging Systems Architect: Multi-Physics for Data Center

Advanced Micro Devices; Austin, Northern (TX, KY); Hybrid; USD 180,000 - 240,000; Full time

Job summary

Advanced Micro Devices (AMD) in Austin, TX seeks a Package-centric Mechanical Modeling Architect to define and drive next-generation packaging-platform architectures. You will develop, validate, and apply mechanical and multi-physics models guiding architecture across package, board, and cooling solutions for data center and HPC systems.

The role requires ownership of modeling rigor, collaboration across silicon, package, board, and manufacturing teams, and influence on product roadmaps with a

Qualifications

• MS or PhD in Engineering or physics.
• Experience owning model-based architecture and design decisions across board-, package-, and system-level domains.
• Background in advanced PCB technologies, high-layer-count designs, warpage and stiffness control.
• Ability to influence product roadmaps and collaborate across multiple teams.

Responsibilities

• Drive model-based architecture and design decisions for development and qualification of advanced package technologies.
• Develop and maintain mechanical and multi-physics models and drive validation strategies for STCO.
• Partner with manufacturing to define, optimize, and scale SMT and mechanical assembly processes.
• Engage with PCB suppliers, EMS partners, and component vendors to align material properties with STCO needs.
• Define targets and strategic direction for mechanical and package technology development.
• Serve as an SME for package and board-level architectures focusing on data center platforms.

Skills

Modeling-driven design

Multi-physics modeling

FEA

Thermo-mechanical modeling

Cross-functional leadership

PM/leadership influence

Education

MS or PhD in Engineering or Physics

Tools

FEA software

PCB design tools

Simulation tools

Job description

Advanced Micro Devices (AMD) in Austin, TX seeks a Package-centric Mechanical Modeling Architect to define and drive next-generation packaging-platform architectures. You will develop, validate, and apply mechanical and multi-physics models guiding architecture across package, board, and cooling solutions for data center and HPC systems.

The role requires ownership of modeling rigor, collaboration across silicon, package, board, and manufacturing teams, and influence on product roadmaps with a