Thermal Mechanical Engineer - Lead & Innovate (Onsite)

Hewlett Packard Enterprise; Chippewa Falls (WI); On-site; USD 74,000 - 170,000; Full time

Benefits offered by this job

Health & Wellbeing

Personal & Professional Development

Unconditional Inclusion

Job summary

Hewlett Packard Enterprise in Wisconsin is seeking a Mechanical/Hardware Engineer (Thermal) to tackle system level cooling challenges for server designs. You will work onsite, leading and collaborating with mechanical hardware teams on design, validation, and tooling, focusing on fan and heatsink technology, CFD validation, and robust thermal solutions.

The role requires a Bachelor’s or Master’s in Mechanical Engineering and 2–4 years of experience, with strong communication skills and the

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering.
• Typically 2-4 years experience.
• Experience with thermal simulation and testing.

Responsibilities

• Leads multiple project teams of other mechanical hardware engineers and internal and outsourced development partners responsible for all stages of mechanical and thermal development for complex products and platforms, including solution design, validation, tooling and testing.
• Manages and expands relationships with internal and outsourced development partners on mechanical and thermal design and development.
• Reviews and evaluates designs and project activities for compliance with technology and development guidelines and standards; provides tangible feedback to improve product quality.
• Provides domain-specific expertise and overall mechanical/thermal leadership and perspective to cross-organization projects, programs, and activities.
• Drives innovation and integration of new technologies into projects and activities in the mechanical and thermal design organization.
• Provides guidance and mentoring to less- experienced staff members.
• Communicates well verbally, in writing, and graphically.
• Works independently and as part of a team.

Skills

3D CAD

CFD

Thermal analysis

Team leadership

Education

Bachelor's or Master's degree in Mechanical Engineering

Job description

Hewlett Packard Enterprise in Wisconsin is seeking a Mechanical/Hardware Engineer (Thermal) to tackle system level cooling challenges for server designs. You will work onsite, leading and collaborating with mechanical hardware teams on design, validation, and tooling, focusing on fan and heatsink technology, CFD validation, and robust thermal solutions.

The role requires a Bachelor’s or Master’s in Mechanical Engineering and 2–4 years of experience, with strong communication skills and the