Mechanical Design Engineer – Enclosures & Thermal

Hewlett Packard Enterprise; Chippewa Falls (WI); On-site; USD 65,000 - 151,000; Full time

Job summary

Hewlett Packard Enterprise in Wisconsin is seeking a Mechanical Engineer to design mechanical and thermal hardware, electronics enclosures, and production tooling in line with specifications.

You will implement test plans to validate tolerances, form/fit/function, shock and vibration, EMI, safety and reliability, and collaborate with internal and outsourced partners to deliver reliable, cost-effective solutions for low to moderately complex products.

Qualifications

• Bachelor's or Master's degree in Mechanical Engineering.
• Typically 0–2 years experience.
• Experience with ProEngineer or similar 3D CAD software.
• Strong analytical and problem-solving skills.
• Good written and verbal communication in English and local language.

Responsibilities

• Design portions of engineering solutions for mechanical and thermal hardware, electronics enclosures, and tooling.
• Implement test plans including tolerance validation, form/fit/function, shock and vibration, EMI, safety, reliability, cooling and acoustics.
• Collaborate with internal and external development partners on mechanical and thermal design.
• Join project teams to deliver reliable, cost-effective, high-quality solutions for low to moderately complex products.

Skills

Analytical thinking

Problem solving

Strong communication

Education

Bachelor's or Master’s degree in Mechanical Engineering

Tools

ProEngineer

Job description

Hewlett Packard Enterprise in Wisconsin is seeking a Mechanical Engineer to design mechanical and thermal hardware, electronics enclosures, and production tooling in line with specifications.

You will implement test plans to validate tolerances, form/fit/function, shock and vibration, EMI, safety and reliability, and collaborate with internal and outsourced partners to deliver reliable, cost-effective solutions for low to moderately complex products.